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1P1G125QDCKRQ1

1P1G125QDCKRQ1

Manufacturer No:

1P1G125QDCKRQ1

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 5.5V SC70-5

Datasheet:

Datasheet

Delivery:

Payment:

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1P1G125QDCKRQ1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100, 74LVC
The SPC56AP60L5BEFAY integrated circuit (IC) chips have several advantages and application scenarios. Some of them are:Advantages: 1. High Performance: The SPC56AP60L5BEFAY chips are based on the Power Architecture? technology and offer high-performance computing capabilities. They are equipped with a 32-bit Power Architecture? e200z0h core, which provides efficient processing power for various applications.2. Enhanced Security: These chips come with advanced security features, including a hardware security module (HSM) and a secure boot mechanism. These features help protect the system from unauthorized access, tampering, and data breaches.3. Connectivity Options: The SPC56AP60L5BEFAY chips support various communication interfaces, such as CAN, LIN, FlexRay, and Ethernet. This makes them suitable for applications that require connectivity with other devices or networks.4. Rich Peripherals: These chips offer a wide range of peripherals, including timers, ADCs, PWMs, UARTs, SPI, I2C, and more. These peripherals enable the integration of multiple functions into a single chip, reducing the need for external components.Application Scenarios: 1. Automotive Systems: The SPC56AP60L5BEFAY chips are commonly used in automotive applications, such as engine control units (ECUs), body control modules (BCMs), and advanced driver-assistance systems (ADAS). Their high performance, security features, and connectivity options make them suitable for these demanding applications.2. Industrial Automation: These chips can be used in industrial automation systems, such as programmable logic controllers (PLCs), motor control units, and robotics. The high-performance computing capabilities and rich peripherals enable efficient control and monitoring of industrial processes.3. Smart Grids: The SPC56AP60L5BEFAY chips can be utilized in smart grid systems for monitoring and controlling power distribution networks. The connectivity options and security features make them suitable for applications that require secure communication and data processing in the energy sector.4. Consumer Electronics: These chips can be employed in various consumer electronic devices, such as home appliances, gaming consoles, and multimedia systems. The high-performance computing capabilities and connectivity options enable the development of feature-rich and connected consumer products.Overall, the SPC56AP60L5BEFAY chips offer high performance, enhanced security, and rich peripherals, making them suitable for a wide range of applications in automotive, industrial, energy, and consumer electronics sectors.
1P1G125QDCKRQ1 Relevant information