SN74LVC125ADR

SN74LVC125ADR

Manufacturer No:

SN74LVC125ADR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 14SOIC

Datasheet:

Datasheet

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SN74LVC125ADR Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    4
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The LM3S300-IQN25-C2 is a microcontroller from Texas Instruments' Stellaris LM3S series. It offers several advantages and can be used in various application scenarios:1. Powerful Processing: The LM3S300-IQN25-C2 chip features a 32-bit ARM Cortex-M3 processor, offering high-performance processing capabilities. This makes it suitable for applications requiring complex computations and real-time processing.2. Embedded Memory and Peripherals: It includes built-in Flash memory, allowing for storing program code and constants within the chip. Additionally, it offers various integrated peripherals like UART, I2C, SPI, GPIO, etc., simplifying the design of systems that require interfacing with external devices.3. Low Power Consumption: The LM3S300-IQN25-C2 chip is designed to be power efficient. It includes power-saving modes, clock gating, and dynamic voltage scaling options, making it suitable for battery-powered or energy-conscious applications.4. Rich Connectivity: The chip supports various communication interfaces such as USB, Ethernet, CAN, and more. This makes it suitable for applications that require connectivity and data exchange with other devices or networks.5. Industrial Reliability: The LM3S300-IQN25-C2 is designed for industrial-grade applications. It is capable of operating in harsh environments with extended temperature ranges, making it suitable for applications requiring high reliability and robustness.Some application scenarios where the LM3S300-IQN25-C2 can be utilized include:1. Embedded Systems: The chip can be used in various embedded systems like industrial automation, motor control, robotics, or home automation. Its processing power and connectivity options enable these systems to perform complex tasks and communicate with other devices.2. Internet of Things (IoT) Devices: With its low power consumption features and connectivity options, the LM3S300-IQN25-C2 is suitable for IoT devices like smart sensors, environmental monitoring systems, and wearable devices. It can acquire sensor data, process it, and transmit it to other devices or cloud platforms.3. Consumer Electronics: The chip's powerful processing and rich peripheral set make it suitable for developing consumer electronics products like audio/video devices, gaming consoles, and home appliances. Its connectivity options also facilitate communication with other devices or online services.4. Instrumentation and Measurement Systems: The LM3S300-IQN25-C2 can be used in systems that require accurate data acquisition, signal processing, and control. It can be utilized in data loggers, test and measurement equipment, medical devices, and scientific instruments.5. Automotive Applications: Its industrial-grade reliability and communication interfaces like CAN make the chip suitable for automotive applications. It can be employed in vehicle control systems, digital dashboards, infotainment systems, or in-vehicle network communication.These are just a few examples, and the applications for the LM3S300-IQN25-C2 chip can vary depending on the specific requirements of the project.