SN74LVC1G240DCKR

SN74LVC1G240DCKR

Manufacturer No:

SN74LVC1G240DCKR

Manufacturer:

Texas Instruments

Description:

IC BUFFER INVERT 5.5V SC70-5

Datasheet:

Datasheet

Delivery:

Payment:

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SN74LVC1G240DCKR Specifications

  • Type
    Parameter
  • Supplier Device Package
    SC-70-5
  • Package / Case
    5-TSSOP, SC-70-5, SOT-353
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Voltage - Supply
    1.65V ~ 5.5V
  • Current - Output High, Low
    32mA, 32mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    1
  • Number of Elements
    1
  • Logic Type
    Buffer, Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The SIM3L146-C-GMR integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: The chips are compact in size, allowing for integration into space-constrained devices and systems. 3. High performance: They offer high-speed data transfer and processing capabilities, enabling efficient and reliable operation. 4. Versatility: The chips support various communication protocols, making them compatible with a wide range of applications. 5. Cost-effective: These chips are cost-effective, making them suitable for mass production and deployment in large-scale projects.Application scenarios: 1. Internet of Things (IoT): The SIM3L146-C-GMR chips can be used in IoT devices for wireless communication, enabling connectivity and data exchange between devices and the cloud. 2. Wearable devices: These chips can be integrated into wearable devices such as smartwatches, fitness trackers, and healthcare monitors, enabling wireless connectivity and data transmission. 3. Home automation: The chips can be used in smart home systems to enable wireless communication between various devices, allowing for remote control and automation of home appliances and systems. 4. Industrial automation: These chips can be utilized in industrial automation systems for wireless communication between sensors, actuators, and control units, enabling efficient monitoring and control of industrial processes. 5. Automotive applications: The chips can be integrated into automotive systems for wireless communication between different components, enabling features such as remote keyless entry, tire pressure monitoring, and vehicle diagnostics.Overall, the SIM3L146-C-GMR integrated circuit chips offer low power consumption, small form factor, high performance, versatility, and cost-effectiveness, making them suitable for a wide range of applications in IoT, wearables, home automation, industrial automation, and automotive sectors.