SN74LVC1G07DBVT
Manufacturer No:
SN74LVC1G07DBVT
Manufacturer:
Description:
IC BUF NON-INVERT 5.5V SOT23-5
Datasheet:
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In Stock : 89377
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SN74LVC1G07DBVT Specifications
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TypeParameter
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Supplier Device PackageSOT-23-5
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Package / CaseSC-74A, SOT-753
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 125°C (TA)
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Voltage - Supply1.65V ~ 5.5V
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Current - Output High, Low-, 32mA
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Output TypeOpen Drain
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Input Type-
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Number of Bits per Element1
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Number of Elements1
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Logic TypeBuffer, Non-Inverting
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series74LVC
The UPD78F1018F1-BA4-A integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: The chips are designed to deliver high performance with a 16-bit microcontroller core, allowing for efficient processing of complex tasks. 2. Low power consumption: The chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Rich peripheral set: The chips come with a wide range of built-in peripherals such as timers, UART, I2C, SPI, and ADC, enabling easy integration with various external devices and sensors. 4. Ample memory: The chips offer a large memory capacity, including flash memory for program storage and RAM for data storage, allowing for the implementation of complex algorithms and data processing. 5. Robust communication capabilities: The chips support various communication protocols like UART, I2C, and SPI, making them suitable for applications requiring data exchange with other devices or systems.Application scenarios: 1. Industrial automation: The chips can be used in industrial automation systems for controlling and monitoring processes, thanks to their high performance, low power consumption, and rich peripheral set. 2. Consumer electronics: The chips can be utilized in consumer electronics devices like home appliances, gaming consoles, or audio systems, where their low power consumption and communication capabilities are beneficial. 3. Internet of Things (IoT): The chips can be employed in IoT devices, such as smart home devices, wearables, or environmental sensors, due to their low power consumption, communication capabilities, and memory capacity. 4. Automotive systems: The chips can be integrated into automotive systems for tasks like engine control, dashboard displays, or advanced driver-assistance systems (ADAS), leveraging their high performance, robust communication capabilities, and memory capacity. 5. Medical devices: The chips can be used in medical devices like patient monitoring systems, medical imaging equipment, or diagnostic devices, benefiting from their high performance, low power consumption, and communication capabilities.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or application.
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