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SN74LVT244BPWR

SN74LVT244BPWR

Manufacturer No:

SN74LVT244BPWR

Manufacturer:

Texas Instruments

Description:

IC BUF NON-INVERT 3.6V 20TSSOP

Datasheet:

Datasheet

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SN74LVT244BPWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2.7V ~ 3.6V
  • Current - Output High, Low
    32mA, 64mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    4
  • Number of Elements
    2
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVT
The DSPIC33FJ64GS610T-I/PF integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33F core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces like UART, SPI, I2C, USB, and CAN, enabling seamless connectivity with other devices. 4. Ample Memory: The chips have a large program memory and data memory, allowing for the implementation of complex algorithms and data storage. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robust Peripherals: The chips offer a wide range of peripherals, including timers, PWM modules, analog-to-digital converters (ADCs), and digital-to-analog converters (DACs), enhancing their versatility.Application Scenarios: 1. Motor Control: The chips' high-performance DSP capabilities and robust peripherals make them ideal for motor control applications, such as industrial automation, robotics, and electric vehicles. 2. Power Electronics: They can be used in power electronics applications like inverters, power supplies, and renewable energy systems, where real-time control and signal processing are crucial. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications, such as audio effects processors, audio amplifiers, and digital audio workstations. 4. Communication Systems: With their built-in communication interfaces, the chips can be used in various communication systems, including wireless communication, IoT devices, and networking equipment. 5. Medical Devices: The chips' high performance, low power consumption, and connectivity options make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment. 6. Automotive Electronics: They can be used in automotive applications like engine control units (ECUs), advanced driver-assistance systems (ADAS), and infotainment systems, where real-time processing and connectivity are essential.Overall, the DSPIC33FJ64GS610T-I/PF integrated circuit chips offer high performance, DSP capabilities, connectivity options, and robust peripherals, making them suitable for a wide range of applications requiring real-time signal processing and control.
SN74LVT244BPWR Relevant information