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MC74LCX541DTR2G

MC74LCX541DTR2G

Manufacturer No:

MC74LCX541DTR2G

Manufacturer:

onsemi

Description:

IC BUF NON-INVERT 3.6V 20TSSOP

Datasheet:

Datasheet

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MC74LCX541DTR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Voltage - Supply
    2V ~ 3.6V
  • Current - Output High, Low
    24mA, 24mA
  • Output Type
    3-State
  • Input Type
    -
  • Number of Bits per Element
    8
  • Number of Elements
    1
  • Logic Type
    Buffer, Non-Inverting
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LCX
The DSPIC33CK64MP202-E/SS integrated circuit chips offer several advantages and can be applied in various scenarios:1. High Performance: These chips are based on the dsPIC33C core, which provides high-performance computing capabilities. They have a maximum operating frequency of 100 MHz, allowing for fast and efficient processing of data.2. Digital Signal Processing (DSP) Capabilities: The dsPIC33C core is specifically designed for DSP applications, making these chips ideal for tasks that require real-time signal processing, such as audio and video processing, motor control, and power conversion.3. Rich Peripherals: The DSPIC33CK64MP202-E/SS chips come with a wide range of peripherals, including multiple UART, SPI, and I2C interfaces, as well as timers, PWM modules, and analog-to-digital converters (ADCs). These peripherals enable seamless integration with various external devices and sensors.4. Enhanced Connectivity: These chips support various communication protocols, such as CAN, USB, and Ethernet, allowing for easy connectivity with other devices and systems. This makes them suitable for applications that require network connectivity or communication with external devices.5. Low Power Consumption: The DSPIC33CK64MP202-E/SS chips are designed to be power-efficient, making them suitable for battery-powered or energy-conscious applications. They offer multiple power-saving modes and features, enabling longer battery life and reduced power consumption.Application Scenarios:1. Industrial Automation: The high-performance computing capabilities and rich peripherals of these chips make them suitable for industrial automation applications, such as motor control, robotics, and process control systems.2. Consumer Electronics: The DSPIC33CK64MP202-E/SS chips can be used in consumer electronics devices that require real-time signal processing, such as audio and video processing, gaming consoles, and home automation systems.3. Power Electronics: These chips are well-suited for power electronics applications, including power conversion, inverters, and motor drives. The DSP capabilities enable precise control and monitoring of power systems.4. Automotive: The enhanced connectivity options and real-time signal processing capabilities make these chips suitable for automotive applications, such as engine control units (ECUs), advanced driver-assistance systems (ADAS), and infotainment systems.5. Internet of Things (IoT): The low power consumption and connectivity features of these chips make them suitable for IoT applications, where devices need to be connected and communicate with each other. Examples include smart home devices, wearable technology, and environmental monitoring systems.Overall, the DSPIC33CK64MP202-E/SS integrated circuit chips offer high-performance DSP capabilities, rich peripherals, and low power consumption, making them versatile for a wide range of applications in various industries.
MC74LCX541DTR2G Relevant information