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GX3290-CBE3

GX3290-CBE3

Manufacturer No:

GX3290-CBE3

Manufacturer:

Semtech Corporation

Description:

IC VIDEO CROSSPOINT SW 2377FCBGA

Datasheet:

Datasheet

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GX3290-CBE3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    2377-FCBGA (50x50)
  • Package / Case
    2377-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 1.26V, 1.71V ~ 1.89V, 2.375V ~ 2.625V
  • Control Interface
    Logic
  • Standards
    -
  • Applications
    Professional Video
  • Function
    Switch
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The DSPIC33EP128GS806T-I/PT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33E core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 4. Ample Memory: With 128 KB of Flash memory and 16 KB of RAM, these chips provide sufficient storage for program code and data. 5. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications. 6. Robust Peripherals: They offer a wide range of peripherals, including timers, PWM modules, analog-to-digital converters (ADCs), and digital-to-analog converters (DACs), enhancing their versatility.Application Scenarios: 1. Motor Control: The chips' high-performance DSP capabilities and robust peripherals make them ideal for motor control applications, such as industrial automation, robotics, and electric vehicles. 2. Power Electronics: With their ability to handle complex algorithms and connectivity options, these chips can be used in power electronics applications like inverters, power supplies, and renewable energy systems. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications, including audio effects, audio synthesis, and audio amplification. 4. Communication Systems: The integrated communication interfaces enable these chips to be used in various communication systems, such as wireless sensor networks, IoT devices, and data loggers. 5. Medical Devices: The chips' high performance, low power consumption, and connectivity options make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33EP128GS806T-I/PT integrated circuit chips offer high performance, DSP capabilities, connectivity, and robust peripherals, making them versatile for a wide range of applications in various industries.
GX3290-CBE3 Relevant information