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GS1575BCTE3

GS1575BCTE3

Manufacturer No:

GS1575BCTE3

Manufacturer:

Semtech Corporation

Description:

IC VIDEO RECLOCKER 64QFN

Datasheet:

Datasheet

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Payment:

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GS1575BCTE3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-QFN (9x9)
  • Package / Case
    64-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    -
  • Control Interface
    -
  • Standards
    -
  • Applications
    -
  • Function
    Reclocker
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Not For New Designs
  • Series
    -
The DSPIC33FJ64MC802-E/MM integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: These chips are based on the dsPIC33F core, which offers high computational performance and efficient instruction execution. 2. Digital Signal Processing (DSP) capabilities: The chips have a wide range of DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced connectivity: They feature various communication interfaces like UART, SPI, I2C, and USB, enabling seamless connectivity with other devices. 4. Rich set of peripherals: The chips come with a variety of peripherals such as timers, PWM modules, ADCs, and DACs, allowing for versatile application development. 5. Low power consumption: They are designed to operate at low power, making them suitable for battery-powered applications.Application scenarios: 1. Motor control: The chips' high-performance DSP capabilities and PWM modules make them ideal for motor control applications, such as robotics, industrial automation, and electric vehicles. 2. Power electronics: The chips can be used in power electronics applications like inverters, power supplies, and energy management systems, thanks to their high computational power and connectivity options. 3. Audio processing: With their DSP capabilities and ADC/DAC peripherals, the chips can be used in audio processing applications like audio effects processors, digital mixers, and audio amplifiers. 4. Communication systems: The chips' communication interfaces and DSP capabilities make them suitable for applications like wireless communication systems, data modems, and networking devices. 5. Medical devices: The chips can be utilized in medical devices such as patient monitoring systems, medical imaging equipment, and diagnostic instruments, owing to their high-performance processing and low power consumption.Overall, the DSPIC33FJ64MC802-E/MM integrated circuit chips offer a combination of high-performance processing, DSP capabilities, and connectivity options, making them suitable for a wide range of applications requiring real-time signal processing and control.
GS1575BCTE3 Relevant information