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SI2167-C55-GM

SI2167-C55-GM

Manufacturer No:

SI2167-C55-GM

Manufacturer:

Skyworks Solutions Inc.

Description:

IC VIDEO DEMODULATOR 48QFN

Datasheet:

Datasheet

Delivery:

Payment:

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SI2167-C55-GM Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-QFN (7x7)
  • Package / Case
    48-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.14V ~ 3.6V
  • Control Interface
    I²C, Serial
  • Standards
    -
  • Applications
    Consumer Video
  • Function
    Demodulator
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The DSPIC33EP128GM310T-I/PF integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33E core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces such as UART, SPI, I2C, and CAN, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips come with a wide range of peripherals like timers, PWM modules, ADCs, and DACs, providing flexibility for different application requirements. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robustness and Reliability: These chips are designed to withstand harsh environments and have built-in protection features like CRC, ECC, and memory lock to ensure data integrity.Application Scenarios: 1. Motor Control: The DSPIC33EP128GM310T-I/PF chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and rich peripherals make them suitable for precise motor control algorithms. 2. Power Electronics: These chips can be used in power electronics applications like inverters, power supplies, and renewable energy systems. Their high-speed ADCs and PWM modules enable accurate control of power conversion processes. 3. Communication Systems: The chips' enhanced connectivity options make them suitable for communication systems like wireless sensor networks, IoT devices, and data loggers. They can easily interface with various communication protocols and enable efficient data processing. 4. Medical Devices: The DSPIC33EP128GM310T-I/PF chips can be used in medical devices like patient monitoring systems, diagnostic equipment, and implantable devices. Their low power consumption, robustness, and DSP capabilities make them suitable for real-time signal processing in medical applications. 5. Automotive Electronics: These chips find applications in automotive electronics, including engine control units, dashboard systems, and safety systems. Their high performance, connectivity options, and reliability make them suitable for demanding automotive environments.Overall, the DSPIC33EP128GM310T-I/PF integrated circuit chips offer a combination of high performance, DSP capabilities, connectivity, and reliability, making them suitable for a wide range of applications in various industries.
SI2167-C55-GM Relevant information