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GX3190-CBE3

GX3190-CBE3

Manufacturer No:

GX3190-CBE3

Manufacturer:

Semtech Corporation

Description:

IC VIDEO CROSSPOINT SW 2377FCBGA

Datasheet:

Datasheet

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GX3190-CBE3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    2377-FCBGA (50x50)
  • Package / Case
    2377-BBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    -
  • Control Interface
    Parallel, Serial
  • Standards
    -
  • Applications
    Professional Video
  • Function
    Switch
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The DSPIC33EP128GM706-H/MR integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33EP128GM706-H/MR chips are designed to deliver high performance with a 70 MIPS (Million Instructions Per Second) performance and a 16-bit microcontroller core. This makes them suitable for applications that require fast and efficient processing.2. Digital Signal Processing (DSP) Capabilities: These chips are specifically designed for applications that require DSP capabilities. They have a wide range of built-in DSP instructions and peripherals, making them ideal for applications such as audio processing, motor control, and digital filters.3. Integrated Peripherals: The chips come with a variety of integrated peripherals, including multiple UART, SPI, and I2C interfaces, as well as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). This makes them suitable for applications that require communication with other devices and sensors.4. Low Power Consumption: The DSPIC33EP128GM706-H/MR chips are designed to operate at low power, making them suitable for battery-powered applications or applications that require energy efficiency.Application Scenarios: 1. Motor Control: The DSPIC33EP128GM706-H/MR chips are commonly used in motor control applications, such as controlling the speed and direction of motors in robotics, industrial automation, and electric vehicles. The DSP capabilities and integrated peripherals make them suitable for precise and efficient motor control.2. Audio Processing: These chips can be used in audio processing applications, such as audio effects processors, audio mixers, and audio amplifiers. The DSP capabilities allow for real-time audio processing and the integrated peripherals enable communication with audio input and output devices.3. Power Electronics: The chips can be applied in power electronics applications, such as power inverters, power supplies, and uninterruptible power supplies (UPS). The high-performance processing capabilities and integrated peripherals make them suitable for controlling and monitoring power electronics systems.4. Sensor Data Processing: The DSPIC33EP128GM706-H/MR chips can be used in applications that require processing data from various sensors, such as temperature sensors, pressure sensors, and motion sensors. The integrated peripherals enable communication with the sensors, and the DSP capabilities allow for real-time data processing and analysis.Overall, the DSPIC33EP128GM706-H/MR integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, and low power consumption, making them suitable for a wide range of applications in various industries.
GX3190-CBE3 Relevant information