SI2176-B30-GM

SI2176-B30-GM

Manufacturer No:

SI2176-B30-GM

Manufacturer:

Skyworks Solutions Inc.

Description:

IC VIDEO TUNER 32QFN

Datasheet:

Datasheet

Delivery:

Payment:

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SI2176-B30-GM Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-QFN (5x5)
  • Package / Case
    32-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    1.8V, 3.3V
  • Control Interface
    GPIO
  • Standards
    NTSC, PAL, SECAM
  • Applications
    Professional Video
  • Function
    Tuner
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The CY96F693ABPMC-GS-UJE2 is a specific model of the integrated circuit (IC) chip. However, without access to specific documentation, it is challenging to provide detailed advantages and application scenarios for this particular chip. IC chips have a wide range of applications across industries, and their advantages can vary depending on the specific chip's features and capabilities.In general, IC chips offer numerous advantages, including:1. Miniaturization: IC chips are compact and can consolidate several discrete components into a single chip, reducing the size and complexity of electronic devices. 2. Power efficiency: By integrating various functions onto a single chip, IC chips can optimize power consumption and extend battery life in portable devices. 3. Reliability: With fewer interconnections, IC chips reduce the chances of loose connections or interference, improving overall reliability. 4. Performance: IC chips can enhance the performance of electronic devices, enabling faster processing, higher data storage capacity, and improved signal transmission. 5. Cost-effectiveness: The consolidation of functions onto a single chip simplifies the manufacturing process, reducing production costs and enhancing economies of scale.To ascertain the specific advantages and application scenarios of the CY96F693ABPMC-GS-UJE2 chip, it is advisable to refer to the manufacturer's documentation or datasheet, where detailed information, including features, specifications, and potential applications, would be provided.