X98014L128-3.3-Z

X98014L128-3.3-Z

Manufacturer No:

X98014L128-3.3-Z

Description:

IC VID DIGITIZER/3-CHAN 128MQFP

Datasheet:

Datasheet

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X98014L128-3.3-Z Specifications

  • Type
    Parameter
  • Supplier Device Package
    128-MQFP (14x20)
  • Package / Case
    128-BFQFP
  • Mounting Type
    Surface Mount
  • Voltage - Supply
    3.0V ~ 3.6V
  • Control Interface
    Serial
  • Standards
    -
  • Applications
    Consumer Video
  • Function
    Digitizer
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The SPC570S50E3CEFAY integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The SPC570S50E3CEFAY chips are based on the Power Architecture? technology and offer high processing power, making them suitable for demanding applications. 2. Safety and Security: These chips come with built-in safety and security features, including hardware security modules, secure boot, and memory protection units, ensuring the integrity and confidentiality of data. 3. Connectivity: The chips support various communication interfaces such as CAN, LIN, FlexRay, Ethernet, and USB, enabling seamless connectivity with other devices and networks. 4. Automotive Grade: The SPC570S50E3CEFAY chips are designed for automotive applications and comply with the industry's stringent requirements for reliability, temperature range, and electromagnetic compatibility. 5. Integrated Peripherals: These chips include a wide range of integrated peripherals such as ADCs, PWMs, timers, and communication interfaces, reducing the need for external components and simplifying system design.Application Scenarios: 1. Automotive Systems: The SPC570S50E3CEFAY chips are commonly used in automotive systems such as engine control units (ECUs), body control modules (BCMs), advanced driver-assistance systems (ADAS), and infotainment systems. 2. Industrial Control: These chips can be employed in industrial control applications, including programmable logic controllers (PLCs), motor control units, and industrial automation systems. 3. Internet of Things (IoT): With their connectivity features, the SPC570S50E3CEFAY chips can be utilized in IoT devices, enabling communication and data processing in smart homes, smart cities, and industrial IoT applications. 4. Medical Devices: The high performance and safety features of these chips make them suitable for medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. 5. Aerospace and Defense: The SPC570S50E3CEFAY chips can be used in aerospace and defense applications, including avionics systems, flight control units, and military-grade communication systems.Overall, the SPC570S50E3CEFAY integrated circuit chips offer high performance, safety, and connectivity, making them suitable for a wide range of applications in automotive, industrial, IoT, medical, and aerospace sectors.