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MAX9108ESD+

MAX9108ESD+

Manufacturer No:

MAX9108ESD+

Description:

IC COMPARATOR 4 GEN PUR 14SOIC

Datasheet:

Datasheet

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MAX9108ESD+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-SOIC
  • Mounting Type
    Surface Mount
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    2mV
  • Propagation Delay (Max)
    25ns
  • CMRR, PSRR (Typ)
    86.02dB CMRR, 86.02dB PSRR
  • Current - Quiescent (Max)
    700µA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    0.125µA @ 5V
  • Voltage - Input Offset (Max)
    1.6mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    4.5V ~ 5.5V
  • Output Type
    TTL
  • Number of Elements
    4
  • Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The DSPIC33FJ32MC204-H/ML integrated circuit (IC) chips offer several advantages and can be applied in various scenarios. Some of the advantages and applications of these chips are:Advantages: 1. High-performance Digital Signal Processing (DSP): The DSPIC33FJ32MC204-H/ML chips provide high-speed DSP capabilities, making them suitable for applications that require advanced signal processing.2. Low Power Consumption: These chips are designed to consume minimal power, making them suitable for battery-powered devices and energy-efficient systems.3. Integration of Peripherals: They feature a range of integrated peripherals, such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, communication interfaces (UART, SPI, I2C), PWM generators, etc. This integration simplifies the design process and reduces the external component count.4. Enhanced Connectivity: The chips support various communication protocols like CAN (Controller Area Network), USB (Universal Serial Bus), Ethernet, etc., enabling connectivity with other devices or networks.5. Robust Security Features: They offer built-in security features like hardware encryption and decryption modules, memory protection features, and authentication mechanisms, ensuring data privacy and system integrity.Application Scenarios: 1. Motor Control: The DSPIC33FJ32MC204-H/ML chips are commonly used in motor control applications. They can control motors with high precision and efficiency, making them suitable for robotics, industrial automation, electric vehicles, and home appliances.2. Power Electronics: These chips can be applied in power electronics systems, such as inverters, converters, and power supplies. They provide precise control over power signals and allow efficient energy conversion.3. Audio Processing: Due to their DSP capabilities, these chips are often employed in audio processing applications. They can perform operations like audio filtering, equalization, noise cancellation, and audio compression, making them suitable for audio equipment and multimedia systems.4. Communication Systems: With their integrated communication interfaces, these chips are ideal for applications involving data exchange between devices. They can be used in wireless communication systems, IoT (Internet of Things) devices, and smart home automation.5. Healthcare Devices: The low power consumption and robust security features of these chips make them suitable for healthcare applications. They can be used in medical monitoring devices, wearable health trackers, and medical instruments.Overall, the DSPIC33FJ32MC204-H/ML integrated circuit chips offer a combination of high-performance signal processing, low power consumption, and integration of peripherals, making them suitable for a wide range of applications in different industries.
MAX9108ESD+ Relevant information