LT1011AIS8#TRPBF
Manufacturer No:
LT1011AIS8#TRPBF
Manufacturer:
Description:
IC COMPARATOR 1 GEN PUR 8SO
Datasheet:
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In Stock : 7049
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LT1011AIS8#TRPBF Specifications
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TypeParameter
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Supplier Device Package8-SO
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Mounting TypeSurface Mount
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Package / Case8-SOIC (0.154", 3.90mm Width)
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Operating Temperature-40°C ~ 85°C
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Hysteresis-
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Propagation Delay (Max)-
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CMRR, PSRR (Typ)115dB CMRR
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Current - Quiescent (Max)4mA
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Current - Output (Typ)50mA
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Current - Input Bias (Max)0.035µA @ ±15V
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Voltage - Input Offset (Max)0.75mV @ ±15V
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Voltage - Supply, Single/Dual (±)3V ~ 36V, ±1.5V ~ 18V
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Output TypeOpen-Collector
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Number of Elements1
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TypeGeneral Purpose
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The DSPIC33FJ32GS606-E/MR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33F core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces such as UART, SPI, I2C, and USB, enabling seamless connectivity with other devices. 4. Rich Peripherals: The chips offer a wide range of peripherals like timers, PWM modules, ADCs, and DACs, allowing for versatile application development. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robustness and Reliability: These chips are designed to withstand harsh environments and have built-in protection features like brown-out reset and watchdog timer.Application Scenarios: 1. Motor Control: The DSPIC33FJ32GS606-E/MR chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and PWM modules make them ideal for precise motor control. 2. Power Electronics: These chips can be used in power electronics applications like inverters, power supplies, and renewable energy systems. Their robustness, high-speed ADCs, and PWM modules enable efficient power conversion and control. 3. Audio Processing: The DSP capabilities of these chips make them suitable for audio processing applications like audio effects, audio synthesis, and digital audio amplifiers. 4. Communication Systems: With their built-in communication interfaces, these chips can be used in various communication systems, including wireless communication, IoT devices, and data acquisition systems. 5. Medical Devices: The chips' low power consumption, robustness, and DSP capabilities make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33FJ32GS606-E/MR integrated circuit chips offer high performance, DSP capabilities, and a wide range of peripherals, making them suitable for various applications requiring real-time signal processing and control.
LT1011AIS8#TRPBF Relevant information