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BU7233F-E2

BU7233F-E2

Manufacturer No:

BU7233F-E2

Manufacturer:

Description:

IC COMPARATOR 2 CMOS 8SOP

Datasheet:

Datasheet

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BU7233F-E2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOP
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.173", 4.40mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    1.8µs (Typ)
  • CMRR, PSRR (Typ)
    80dB CMRR, 80dB PSRR
  • Current - Quiescent (Max)
    25µA
  • Current - Output (Typ)
    6mA @ 3V
  • Current - Input Bias (Max)
    1pA (Typ)
  • Voltage - Input Offset (Max)
    11mV @ 3V
  • Voltage - Supply, Single/Dual (±)
    1.8V ~ 5.5V, ±0.9V ~ 2.75V
  • Output Type
    Open-Drain
  • Number of Elements
    2
  • Type
    CMOS
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The BU7233F-E2 is a specific model of integrated circuit (IC) chip manufactured by ROHM Semiconductor. While I couldn't find specific information about this particular model, I can provide you with general advantages and application scenarios of IC chips.Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Reliability: IC chips are less prone to failure due to their compact design, reduced number of interconnections, and improved manufacturing processes. 3. Power efficiency: IC chips are designed to operate at lower power levels, resulting in reduced energy consumption and longer battery life. 4. Cost-effectiveness: Mass production of IC chips leads to economies of scale, making them more affordable compared to discrete components. 5. Performance: IC chips can offer improved performance due to optimized circuit design, reduced parasitic effects, and enhanced functionality.Application scenarios of IC chips: 1. Consumer electronics: IC chips are extensively used in smartphones, tablets, laptops, televisions, gaming consoles, and other consumer electronic devices. 2. Automotive industry: IC chips are employed in various automotive applications, including engine control units, infotainment systems, advanced driver-assistance systems (ADAS), and powertrain control modules. 3. Industrial automation: IC chips find applications in industrial control systems, robotics, motor drives, sensors, and programmable logic controllers (PLCs). 4. Medical devices: IC chips are used in medical equipment such as patient monitors, imaging systems, pacemakers, insulin pumps, and diagnostic devices. 5. Communication systems: IC chips are crucial components in telecommunications infrastructure, networking equipment, wireless devices, and satellite communication systems. 6. Aerospace and defense: IC chips are utilized in avionics, radar systems, navigation systems, satellite communication, and military equipment.It's important to note that the specific advantages and application scenarios of the BU7233F-E2 chip may vary depending on its intended purpose and specifications. For detailed information about this particular chip, it is recommended to refer to the manufacturer's datasheet or product documentation.
BU7233F-E2 Relevant information