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LMV762MM

LMV762MM

Manufacturer No:

LMV762MM

Manufacturer:

National Semiconductor

Description:

IC COMPARATOR 2 GEN PUR 8VSSOP

Datasheet:

Datasheet

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LMV762MM Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-VSSOP
  • Mounting Type
    Surface Mount
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    225ns
  • CMRR, PSRR (Typ)
    100dB CMRR, 110dB PSRR
  • Current - Quiescent (Max)
    700µA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    50pA @ 5V
  • Voltage - Input Offset (Max)
    0.2mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 5V
  • Output Type
    Push-Pull
  • Number of Elements
    2
  • Type
    General Purpose
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The LMV762MM is a low voltage, low power operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low voltage operation: The LMV762MM is designed to operate at low supply voltages, typically ranging from 1.8V to 5.5V. This makes it suitable for battery-powered devices and low power applications.2. Low power consumption: The chip has a low quiescent current, typically around 20μA, which helps in reducing power consumption and extending battery life in portable devices.3. Rail-to-rail input and output: The LMV762MM supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature is useful in applications where the input or output signals need to be close to the supply rails.4. Wide bandwidth and fast settling time: The chip offers a wide bandwidth and fast settling time, making it suitable for applications that require high-speed signal processing, such as audio amplification, data acquisition, and sensor interfacing.5. Small package size: The LMV762MM is available in a small MSOP-8 package, which makes it suitable for space-constrained applications and compact circuit designs.Application scenarios for the LMV762MM include:1. Portable audio devices: The low voltage and low power consumption characteristics of the chip make it suitable for use in portable audio devices like smartphones, MP3 players, and portable speakers.2. Sensor interfaces: The rail-to-rail input and output capability, along with the wide bandwidth, make the LMV762MM suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, and light sensors.3. Battery-powered systems: The low power consumption and wide supply voltage range of the chip make it suitable for use in battery-powered systems, such as wireless sensor networks, wearable devices, and IoT applications.4. Signal conditioning: The LMV762MM can be used for signal conditioning in various applications, such as data acquisition systems, instrumentation amplifiers, and analog signal processing circuits.5. Low voltage applications: The chip's ability to operate at low supply voltages makes it suitable for low voltage applications, such as handheld devices, medical devices, and automotive electronics.Overall, the LMV762MM offers advantages of low voltage operation, low power consumption, rail-to-rail capability, and small package size, making it suitable for a wide range of applications requiring low power and small form factor.
LMV762MM Relevant information