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LMV761MAX

LMV761MAX

Manufacturer No:

LMV761MAX

Manufacturer:

Texas Instruments

Description:

IC COMPARATOR 1 GEN PUR 8SOIC

Datasheet:

Datasheet

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LMV761MAX Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    225ns
  • CMRR, PSRR (Typ)
    100dB CMRR, 110dB PSRR
  • Current - Quiescent (Max)
    700µA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    50pA @ 5V
  • Voltage - Input Offset (Max)
    0.2mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 5V
  • Output Type
    Push-Pull
  • Number of Elements
    1
  • Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LMV761MAX is a low-power operational amplifier (op-amp) integrated circuit chip manufactured by Texas Instruments. It offers several advantages and can be applied in various scenarios. Here are some of its advantages and application scenarios:Advantages: 1. Low Power Consumption: The LMV761MAX is designed to operate with low power consumption, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. Rail-to-Rail Input and Output: This op-amp chip supports rail-to-rail input and output voltage ranges, allowing it to handle signals that span the entire supply voltage range. This feature ensures accurate signal amplification and compatibility with various signal levels.3. Wide Bandwidth: The LMV761MAX has a wide bandwidth, enabling it to amplify high-frequency signals accurately. This makes it suitable for applications that require amplification of audio, video, or other high-frequency signals.4. Low Input Offset Voltage: The chip has a low input offset voltage, which minimizes errors in amplification and improves overall accuracy in signal processing applications.5. Small Package Size: The LMV761MAX is available in a small package size, making it suitable for space-constrained applications or designs where miniaturization is essential.Application Scenarios: 1. Portable Audio Devices: The low power consumption and small package size of the LMV761MAX make it suitable for use in portable audio devices such as smartphones, MP3 players, and portable speakers.2. Sensor Signal Conditioning: The op-amp chip can be used for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or light sensors. Its low power consumption and accuracy make it suitable for sensor applications.3. Battery-Powered Systems: The LMV761MAX's low power consumption and rail-to-rail input/output capabilities make it ideal for battery-powered systems, such as wireless sensor networks, IoT devices, or wearable electronics.4. Signal Processing and Filtering: The wide bandwidth and low input offset voltage of the chip make it suitable for signal processing and filtering applications. It can be used in audio amplifiers, active filters, or other applications that require accurate signal amplification and conditioning.5. Industrial and Automotive Electronics: The LMV761MAX can be used in various industrial and automotive electronics applications, such as motor control, instrumentation, or automotive sensor interfaces. Its low power consumption and small package size make it suitable for integration into these systems.Overall, the LMV761MAX offers low power consumption, rail-to-rail capabilities, wide bandwidth, and small package size, making it a versatile choice for various low-power and space-constrained applications requiring accurate signal amplification and conditioning.
LMV761MAX Relevant information