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LMC6772BIN

LMC6772BIN

Manufacturer No:

LMC6772BIN

Manufacturer:

Texas Instruments

Description:

IC COMPARATOR 2 GEN PUR 8DIP

Datasheet:

Datasheet

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LMC6772BIN Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-PDIP
  • Mounting Type
    Through Hole
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    10µs
  • CMRR, PSRR (Typ)
    75dB CMRR, 80dB PSRR
  • Current - Quiescent (Max)
    20µA
  • Current - Output (Typ)
    30mA
  • Current - Input Bias (Max)
    0.04pA @ 5V
  • Voltage - Input Offset (Max)
    15mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 15V, ±1.35V ~ 7.5V
  • Output Type
    Open-Drain
  • Number of Elements
    2
  • Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The LMC6772BIN is a specific model of integrated circuit (IC) chip manufactured by Texas Instruments. It is a dual operational amplifier chip with rail-to-rail input and output capabilities. Here are some advantages and application scenarios of the LMC6772BIN IC chip:Advantages: 1. Rail-to-rail input and output: The chip can operate with input and output voltages that span the entire supply voltage range, allowing for maximum utilization of the available voltage range. 2. Low input offset voltage: The chip has a low input offset voltage, which minimizes errors in amplification and signal processing. 3. Low input bias current: The chip has a low input bias current, reducing the impact of current flow on the input signal and improving accuracy. 4. Low quiescent current: The chip has a low quiescent current, making it suitable for low-power applications and extending battery life in portable devices. 5. Wide supply voltage range: The chip can operate with a wide range of supply voltages, providing flexibility in various applications.Application scenarios: 1. Signal conditioning: The LMC6772BIN chip can be used for amplifying and conditioning analog signals in various applications such as sensor interfaces, data acquisition systems, and instrumentation. 2. Audio amplification: The rail-to-rail capabilities of the chip make it suitable for audio amplification applications, where it can drive headphones, speakers, or other audio devices. 3. Battery-powered devices: The low quiescent current and wide supply voltage range make the chip suitable for battery-powered devices, such as portable audio players, handheld instruments, or wireless sensors. 4. Industrial automation: The chip can be used in industrial automation systems for signal processing, control, and monitoring applications. 5. Automotive electronics: The LMC6772BIN chip can find applications in automotive electronics, such as in-car audio systems, sensor interfaces, or control modules.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.
LMC6772BIN Relevant information