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LM2903DG4

LM2903DG4

Manufacturer No:

LM2903DG4

Manufacturer:

Texas Instruments

Description:

IC COMPARATOR 2 DIFF 8SOIC

Datasheet:

Datasheet

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LM2903DG4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    -
  • CMRR, PSRR (Typ)
    -
  • Current - Quiescent (Max)
    2.5mA
  • Current - Output (Typ)
    20mA
  • Current - Input Bias (Max)
    0.25µA @ 5V
  • Voltage - Input Offset (Max)
    7mV @ 30V
  • Voltage - Supply, Single/Dual (±)
    2V ~ 36V, ±1V ~ 18V
  • Output Type
    Open-Collector, Rail-to-Rail
  • Number of Elements
    2
  • Type
    General Purpose
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DSPIC33EP512MC502-H/MM integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33EP512MC502-H/MM chips are designed to deliver high performance with a 70 MIPS (Million Instructions Per Second) performance and a 16-bit microcontroller core. This makes them suitable for applications that require fast and efficient processing.2. Digital Signal Processing (DSP) Capabilities: These chips are specifically designed for applications that require DSP capabilities. They have a wide range of built-in DSP instructions and peripherals, making them ideal for applications such as audio processing, motor control, and digital filters.3. Integrated Peripherals: The chips come with a wide range of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration reduces the need for external components, simplifies the design, and saves board space.4. Low Power Consumption: The DSPIC33EP512MC502-H/MM chips are designed to operate at low power, making them suitable for battery-powered applications or applications that require energy efficiency.Application Scenarios: 1. Motor Control: The DSPIC33EP512MC502-H/MM chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and integrated peripherals make them suitable for precise and efficient motor control.2. Audio Processing: These chips can be used in audio processing applications, such as audio effects processors, audio mixers, and digital audio amplifiers. The DSP capabilities and integrated ADCs/DACs enable high-quality audio processing and playback.3. Power Electronics: The chips can be applied in power electronics applications, such as power inverters, power supplies, and renewable energy systems. Their high-performance processing and integrated peripherals allow for efficient control and monitoring of power electronics systems.4. Communication Systems: The DSPIC33EP512MC502-H/MM chips can be used in communication systems, such as wireless communication modules, IoT devices, and data loggers. The integrated peripherals, including UARTs, SPI, and I2C, enable seamless communication with other devices or networks.5. Medical Devices: These chips can be utilized in medical devices, such as patient monitoring systems, medical imaging equipment, and diagnostic devices. Their high-performance processing and low power consumption make them suitable for real-time data processing and analysis in medical applications.Overall, the DSPIC33EP512MC502-H/MM integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, and low power consumption, making them versatile for a wide range of applications.
LM2903DG4 Relevant information