Home / Comparators / BU7233SF-E2/
BU7233SF-E2

BU7233SF-E2

Manufacturer No:

BU7233SF-E2

Manufacturer:

Description:

IC COMPARATOR 2 CMOS 8SOP

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

BU7233SF-E2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOP
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Operating Temperature
    -40°C ~ 105°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    1.8µs
  • CMRR, PSRR (Typ)
    80dB CMRR, 80dB PSRR
  • Current - Quiescent (Max)
    25µA
  • Current - Output (Typ)
    6mA @ 3V
  • Current - Input Bias (Max)
    1pA @ 3V
  • Voltage - Input Offset (Max)
    11mV @ 3V
  • Voltage - Supply, Single/Dual (±)
    1.8V ~ 5.5V, ±0.9V ~ 2.75V
  • Output Type
    CMOS, Open-Drain
  • Number of Elements
    2
  • Type
    CMOS
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The BU7233SF-E2 is a specific model of integrated circuit (IC) chip manufactured by ROHM Semiconductor. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BU7233SF-E2:Advantages: 1. High Efficiency: The BU7233SF-E2 is designed to provide high efficiency in power management applications, allowing for optimized power usage and reduced energy consumption. 2. Compact Size: The IC chip is designed to be compact, making it suitable for applications where space is limited. 3. Low Power Consumption: The chip is designed to have low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 4. Protection Features: The BU7233SF-E2 may include various protection features such as overcurrent protection, overvoltage protection, and thermal shutdown, ensuring the safety and reliability of the connected devices.Application Scenarios: 1. Power Management: The BU7233SF-E2 can be used in various power management applications, such as voltage regulation, power supply control, and battery charging circuits. 2. Consumer Electronics: The chip can be utilized in consumer electronic devices like smartphones, tablets, portable media players, and other battery-powered devices to optimize power usage and extend battery life. 3. Industrial Automation: The BU7233SF-E2 can be employed in industrial automation systems, such as motor control circuits, to regulate power supply and protect against overcurrent or overvoltage conditions. 4. Automotive Electronics: The chip can be used in automotive applications, such as in-car entertainment systems, infotainment systems, or power management circuits, to ensure efficient power usage and protection against electrical faults. 5. IoT Devices: The BU7233SF-E2 can be integrated into Internet of Things (IoT) devices, such as smart home appliances, wearable devices, or sensor nodes, to provide power management and protection capabilities.It is important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the BU7233SF-E2 chip and the system it is being integrated into. It is recommended to refer to the datasheet and technical documentation provided by the manufacturer for detailed information and specific use cases.
BU7233SF-E2 Relevant information