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HMC875LC3CTR

HMC875LC3CTR

Manufacturer No:

HMC875LC3CTR

Manufacturer:

Analog Devices Inc.

Description:

IC COMPARATOR 1 GEN PUR 16SMT

Datasheet:

Datasheet

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HMC875LC3CTR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SMT (3x3)
  • Mounting Type
    Surface Mount
  • Package / Case
    16-LFQFN Exposed Pad
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    1mV
  • Propagation Delay (Max)
    0.12ns
  • CMRR, PSRR (Typ)
    35dB PSRR
  • Current - Quiescent (Max)
    12mA
  • Current - Output (Typ)
    9mA
  • Current - Input Bias (Max)
    15µV
  • Voltage - Input Offset (Max)
    5mV
  • Voltage - Supply, Single/Dual (±)
    3.3V
  • Output Type
    CML
  • Number of Elements
    1
  • Type
    General Purpose
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The HMC875LC3CTR is a high-performance integrated circuit chip designed for various applications in the field of radio frequency (RF) and microwave systems. Some of the advantages and application scenarios of this chip are:1. Wideband operation: The HMC875LC3CTR offers a wide frequency range of 0.01 GHz to 20 GHz, making it suitable for a broad range of RF and microwave applications.2. Low noise figure: With a noise figure as low as 2.5 dB, this chip ensures minimal degradation of the signal quality, making it ideal for sensitive RF and microwave systems.3. High gain: The HMC875LC3CTR provides a high gain of up to 20 dB, enabling amplification of weak signals and improving overall system performance.4. High linearity: This chip exhibits excellent linearity, ensuring minimal distortion and maintaining signal integrity even at high power levels.5. Compact size: The HMC875LC3CTR is available in a small form factor, making it suitable for space-constrained applications where size and weight are critical factors.6. Wireless communication systems: This chip can be used in various wireless communication systems, including cellular networks, satellite communication, Wi-Fi, and radar systems, to amplify and process RF signals.7. Test and measurement equipment: The HMC875LC3CTR can be utilized in test and measurement equipment, such as spectrum analyzers, signal generators, and network analyzers, to enhance signal quality and measurement accuracy.8. Aerospace and defense applications: Due to its high performance, the HMC875LC3CTR is well-suited for aerospace and defense applications, including radar systems, electronic warfare, and satellite communication systems.9. Medical equipment: This chip can be employed in medical devices, such as MRI machines, wireless patient monitoring systems, and medical imaging equipment, to amplify and process RF signals.10. Research and development: The HMC875LC3CTR can be used in various research and development projects related to RF and microwave systems, where high-performance amplification and signal processing are required.Overall, the HMC875LC3CTR integrated circuit chip offers excellent performance characteristics and finds applications in a wide range of RF and microwave systems, including wireless communication, test and measurement, aerospace, defense, medical, and research fields.
HMC875LC3CTR Relevant information