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KA339DTF Specifications
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TypeParameter
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Supplier Device Package14-SOP
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Mounting TypeSurface Mount
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Package / Case14-SOIC (0.154", 3.90mm Width)
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Operating Temperature0°C ~ 70°C
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Hysteresis-
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Propagation Delay (Max)-
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CMRR, PSRR (Typ)-
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Current - Quiescent (Max)2.5mA
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Current - Output (Typ)18mA @ 5V
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Current - Input Bias (Max)0.25µA @ 5V
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Voltage - Input Offset (Max)5mV @ 5V
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Voltage - Supply, Single/Dual (±)2V ~ 36V, ±1V ~ 18V
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Output TypeDTL, MOS, Open-Collector, TTL
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Number of Elements4
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TypeGeneral Purpose
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series-
The DSPIC33EP128GM306T-I/PT integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33E core, which offers high performance and efficient execution of complex algorithms. 2. Digital Signal Processing (DSP) Capabilities: The chips have built-in DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced Connectivity: They feature various communication interfaces such as UART, SPI, I2C, CAN, and USB, enabling seamless connectivity with other devices. 4. Ample Memory: The chips have a large program memory and data memory, allowing for the implementation of complex algorithms and data storage. 5. Low Power Consumption: They are designed to operate at low power, making them suitable for battery-powered applications. 6. Robust Peripherals: The chips offer a wide range of peripherals, including timers, PWM modules, analog-to-digital converters (ADCs), and digital-to-analog converters (DACs), enhancing their versatility.Application Scenarios: 1. Motor Control: The chips' high-performance DSP capabilities and robust peripherals make them ideal for motor control applications, such as industrial automation, robotics, and electric vehicles. 2. Power Electronics: They can be used in power electronics applications, including inverters, power supplies, and energy management systems, where real-time signal processing and precise control are required. 3. Communication Systems: The chips' connectivity options and DSP capabilities make them suitable for communication systems, such as wireless sensor networks, IoT devices, and data communication modules. 4. Audio Processing: They can be used in audio processing applications, such as audio amplifiers, audio effects processors, and digital audio workstations, where real-time signal processing and high-quality audio output are essential. 5. Medical Devices: The chips' high-performance DSP capabilities and low power consumption make them suitable for medical devices, including patient monitoring systems, medical imaging, and diagnostic equipment. 6. Automotive Electronics: They can be used in automotive electronics applications, such as engine control units (ECUs), advanced driver-assistance systems (ADAS), and infotainment systems, where real-time signal processing and connectivity are crucial.Overall, the DSPIC33EP128GM306T-I/PT integrated circuit chips offer high performance, DSP capabilities, connectivity options, and robust peripherals, making them suitable for a wide range of applications requiring real-time signal processing and control.
KA339DTF Relevant information