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HMC875LC3C

HMC875LC3C

Manufacturer No:

HMC875LC3C

Manufacturer:

Analog Devices Inc.

Description:

IC COMPARATOR 1 GEN PUR 16SMT

Datasheet:

Datasheet

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HMC875LC3C Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SMT (3x3)
  • Mounting Type
    Surface Mount
  • Package / Case
    16-LFQFN Exposed Pad
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    1mV
  • Propagation Delay (Max)
    0.12ns
  • CMRR, PSRR (Typ)
    35dB PSRR
  • Current - Quiescent (Max)
    12mA
  • Current - Output (Typ)
    9mA
  • Current - Input Bias (Max)
    15µV
  • Voltage - Input Offset (Max)
    5mV
  • Voltage - Supply, Single/Dual (±)
    3.3V
  • Output Type
    CML
  • Number of Elements
    1
  • Type
    General Purpose
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The HMC875LC3C is a high-performance integrated circuit chip designed for various applications in the field of radio frequency (RF) and microwave systems. Some of the advantages and application scenarios of this chip are:1. Wideband operation: The HMC875LC3C offers a wide frequency range of 0.01 GHz to 20 GHz, making it suitable for a broad range of RF and microwave applications.2. Low noise figure: With a typical noise figure of 2.5 dB, this chip provides excellent signal-to-noise ratio, making it ideal for low-noise amplification in sensitive RF systems.3. High gain: The HMC875LC3C offers a typical gain of 20 dB, enabling it to amplify weak signals and improve overall system performance.4. High linearity: This chip exhibits high linearity, ensuring minimal distortion and maintaining signal integrity in high-power RF applications.5. Compact size: The HMC875LC3C is available in a small form factor, making it suitable for space-constrained applications where size and weight are critical factors.6. Communication systems: This chip can be used in various communication systems, including wireless infrastructure, satellite communication, radar systems, and point-to-point communication.7. Test and measurement equipment: The HMC875LC3C can be utilized in test and measurement equipment, such as spectrum analyzers, signal generators, and network analyzers, to enhance signal processing and measurement accuracy.8. Defense and aerospace: Due to its high performance and reliability, this chip finds applications in defense and aerospace systems, including radar systems, electronic warfare, and satellite communication.9. Medical equipment: The HMC875LC3C can be employed in medical equipment, such as MRI machines, wireless patient monitoring systems, and medical imaging devices, to enhance signal processing and data transmission.10. Industrial applications: This chip can be used in industrial applications, such as industrial automation, process control, and instrumentation, where high-frequency signal amplification and processing are required.Overall, the HMC875LC3C integrated circuit chip offers excellent performance characteristics and finds applications in a wide range of RF and microwave systems across various industries.
HMC875LC3C Relevant information