TC75W58FU,LF

TC75W58FU,LF

Manufacturer No:

TC75W58FU,LF

Description:

IC COMPARATOR 2 GEN PUR 8SSOP

Datasheet:

Datasheet

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TC75W58FU,LF Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SSOP
  • Mounting Type
    Surface Mount
  • Package / Case
    8-TSSOP, 8-MSOP (0.110", 2.80mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    800ns
  • CMRR, PSRR (Typ)
    -
  • Current - Quiescent (Max)
    22µA
  • Current - Output (Typ)
    25mA
  • Current - Input Bias (Max)
    1pA @ 5V
  • Voltage - Input Offset (Max)
    7mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    1.8V ~ 7V, ±0.9V ~ 3.5V
  • Output Type
    Open-Drain
  • Number of Elements
    2
  • Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The DSPIC33EP512MC504-E/PT is a high-performance, 16-bit Digital Signal Controller (DSC) chip manufactured by Microchip Technology. It offers several advantages and can be applied in various scenarios:1. High Performance: The DSPIC33EP512MC504-E/PT chip is built on a high-performance core, offering up to 70 MIPS (Million Instructions per Second) of performance. This makes it suitable for demanding applications that require fast and efficient signal processing.2. Digital Signal Processing (DSP) Capabilities: As a DSC chip, it combines the features of a microcontroller and a digital signal processor. It includes a rich set of DSP instructions and peripherals, allowing for efficient implementation of complex algorithms and signal processing tasks.3. Integrated Peripherals: The chip includes a wide range of integrated peripherals, such as multiple UARTs, SPI, I2C, and CAN communication interfaces, multiple PWM modules, analog-to-digital converters (ADCs), and more. These peripherals enable easy integration with various sensors, actuators, and communication protocols.4. Enhanced Connectivity: The DSPIC33EP512MC504-E/PT chip supports various communication protocols, including USB, Ethernet, and CAN. This makes it suitable for applications requiring connectivity, such as industrial automation, motor control, and communication gateways.5. Robustness and Reliability: The chip is designed to operate in harsh environments, with features like high-temperature operation, low-voltage operation, and robust ESD protection. This makes it suitable for applications in automotive, industrial, and aerospace sectors.Application Scenarios:1. Motor Control: The DSPIC33EP512MC504-E/PT chip's high-performance core, integrated PWM modules, and analog-to-digital converters make it suitable for motor control applications. It can be used in applications like robotics, industrial automation, and electric vehicles.2. Power Electronics: The chip's DSP capabilities and integrated peripherals make it suitable for power electronics applications, such as power inverters, uninterruptible power supplies (UPS), and renewable energy systems.3. Communication Systems: With its integrated communication interfaces and high-performance core, the chip can be used in communication systems, such as data loggers, communication gateways, and IoT devices.4. Industrial Automation: The chip's robustness, integrated peripherals, and communication capabilities make it suitable for industrial automation applications, including PLCs (Programmable Logic Controllers), process control, and monitoring systems.5. Medical Devices: The chip's high-performance core and DSP capabilities make it suitable for medical devices that require real-time signal processing, such as patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33EP512MC504-E/PT chip offers high performance, integrated peripherals, and robustness, making it suitable for a wide range of applications that require efficient signal processing and control.