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TLV3501AID

TLV3501AID

Manufacturer No:

TLV3501AID

Manufacturer:

Texas Instruments

Description:

IC COMPARATOR 1 GEN PUR 8SOIC

Datasheet:

Datasheet

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TLV3501AID Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Hysteresis
    6mV
  • Propagation Delay (Max)
    10ns
  • CMRR, PSRR (Typ)
    70dB CMRR, 100dB PSRR
  • Current - Quiescent (Max)
    5mA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    10pA @ 5.5V
  • Voltage - Input Offset (Max)
    6.5mV @ 5.5V
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 5.5V, ±1.35V ~ 2.75V
  • Output Type
    CMOS, Push-Pull, Rail-to-Rail, TTL
  • Number of Elements
    1
  • Type
    General Purpose
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The DSPIC30F3013-20E/ML integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: These chips are based on the 16-bit dsPIC30F core, which provides high-performance computing capabilities suitable for various applications. 2. Embedded peripherals: They offer a wide range of on-chip peripherals such as ADC, PWM, timers, UART, SPI, I2C, etc., which enhance their functionality and reduce external component requirements. 3. Digital Signal Processing (DSP) capabilities: The integrated DSP engine allows the chips to perform complex mathematical calculations and signal processing tasks efficiently. 4. Extended memory options: They support up to 144 KB of Enhanced Flash program memory and up to 8 KB of RAM, providing ample space for program storage and data manipulation. 5. Low power consumption: These chips are designed to optimize power consumption, making them suitable for battery-powered applications or situations where energy efficiency is essential. 6. Versatility: The chips can be programmed using various development tools and programming languages, allowing flexibility in application development.Application scenarios: 1. Industrial control systems: The chips can be used in industrial automation applications such as motor control, power monitoring, sensor interfacing, and data acquisition systems. 2. Communication systems: With their built-in UART, SPI, and I2C interfaces, these chips can be utilized in communication systems like wireless modules, IoT devices, and networking equipment. 3. Consumer electronics: They can be applied in consumer electronics products like home appliances, audio/video systems, and digital control panels. 4. Automotive applications: The chips find applications in automotive systems such as engine control units (ECUs), powertrain control modules, electric power steering, and advanced driver-assistance systems. 5. Medical devices: Due to their high-performance computing abilities and low power consumption, these chips can be used in medical devices like patient monitors, drug delivery systems, and diagnostic equipment.These are just a few examples of the advantages and application scenarios of the DSPIC30F3013-20E/ML integrated circuit chips. The versatility and performance of these chips make them suitable for various embedded systems and control applications.
TLV3501AID Relevant information