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LMV762QMAX/NOPB

LMV762QMAX/NOPB

Manufacturer No:

LMV762QMAX/NOPB

Manufacturer:

Texas Instruments

Description:

IC COMPARATOR 2 GEN PUR 8SOIC

Datasheet:

Datasheet

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LMV762QMAX/NOPB Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    225ns
  • CMRR, PSRR (Typ)
    100dB CMRR, 110dB PSRR
  • Current - Quiescent (Max)
    700µA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    50pA @ 5V
  • Voltage - Input Offset (Max)
    0.2mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 5V
  • Output Type
    Push-Pull
  • Number of Elements
    2
  • Type
    General Purpose
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The LMV762QMAX/NOPB is a low-power, low-voltage operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:1. Low power consumption: The LMV762QMAX/NOPB is designed to operate at low power levels, making it suitable for battery-powered devices and applications where power efficiency is crucial.2. Low voltage operation: This chip can operate at low supply voltages, typically ranging from 1.8V to 5.5V. It is ideal for applications that require low voltage operation, such as portable electronics and low-power sensor circuits.3. Rail-to-rail input and output: The LMV762QMAX/NOPB supports rail-to-rail input and output voltage ranges. This means that it can handle signals that swing close to the power supply rails, allowing for maximum utilization of the available voltage range.4. Wide bandwidth and fast settling time: This chip offers a wide bandwidth and fast settling time, making it suitable for applications that require high-speed signal processing, such as audio amplification, data acquisition, and communication systems.5. Small package size: The LMV762QMAX/NOPB is available in a small package size, such as the 8-pin SOIC package. This compact form factor makes it suitable for space-constrained applications, including portable devices and miniaturized circuits.Application scenarios for the LMV762QMAX/NOPB include:1. Portable audio devices: The low power consumption and small package size make this chip suitable for portable audio devices, such as MP3 players, smartphones, and portable speakers.2. Sensor interfaces: The low voltage operation and rail-to-rail input/output capabilities make the LMV762QMAX/NOPB suitable for sensor interface circuits, where low power consumption and accurate signal conditioning are required.3. Battery-powered systems: The low power consumption and wide supply voltage range make this chip ideal for battery-powered systems, such as wireless sensors, remote controls, and wearable devices.4. Communication systems: The high bandwidth and fast settling time of the LMV762QMAX/NOPB make it suitable for communication systems, including data transmission, signal conditioning, and amplification in wireless communication devices.5. Industrial and automotive applications: The LMV762QMAX/NOPB can be used in various industrial and automotive applications, such as motor control, instrumentation, and control systems, where low power consumption, small size, and wide supply voltage range are essential.
LMV762QMAX/NOPB Relevant information