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BU7232SF-E2

BU7232SF-E2

Manufacturer No:

BU7232SF-E2

Manufacturer:

Description:

IC COMPARATOR 2 GEN PUR 8SOP

Datasheet:

Datasheet

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BU7232SF-E2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOP
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.173", 4.40mm Width)
  • Operating Temperature
    -40°C ~ 105°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    1.7µs
  • CMRR, PSRR (Typ)
    80dB CMRR, 80dB PSRR
  • Current - Quiescent (Max)
    25µA
  • Current - Output (Typ)
    6mA @ 3V
  • Current - Input Bias (Max)
    1pA @ 3V
  • Voltage - Input Offset (Max)
    11mV @ 3V
  • Voltage - Supply, Single/Dual (±)
    1.8V ~ 5.5V, ±0.9V ~ 2.75V
  • Output Type
    Push-Pull
  • Number of Elements
    2
  • Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The R5F211A4DSP#U0 is an integrated circuit chip developed by Renesas Electronics Corporation. It belongs to the R8C/Tiny Series of microcontrollers and offers several advantages and application scenarios:Advantages: 1. Low Power Consumption: The R5F211A4DSP#U0 chip is designed to operate at low power, making it suitable for battery-powered devices and applications where power efficiency is crucial. 2. Small Package Size: With a compact package size, this chip is ideal for space-constrained applications where size reduction is essential. 3. High Performance: Despite its small size, the R5F211A4DSP#U0 chip offers high-performance capabilities, enabling it to handle complex tasks efficiently. 4. Rich Peripherals: The chip provides a range of built-in peripherals such as timers, UART, I2C, SPI, and ADC, which enhance its versatility and make it suitable for various applications. 5. Cost-Effective: The R5F211A4DSP#U0 chip offers a cost-effective solution for applications that require a balance between performance and affordability.Application Scenarios: 1. Consumer Electronics: The low power consumption and small package size of the R5F211A4DSP#U0 chip make it suitable for various consumer electronic devices such as wearable devices, remote controls, and smart home appliances. 2. Industrial Automation: The high-performance capabilities and rich peripherals of the chip make it suitable for industrial automation applications, including motor control, sensor interfacing, and data acquisition systems. 3. Internet of Things (IoT): With its low power consumption and compact size, the chip can be used in IoT devices such as smart sensors, environmental monitoring systems, and asset tracking devices. 4. Automotive Electronics: The R5F211A4DSP#U0 chip can be utilized in automotive applications that require small form factor and low power consumption, such as dashboard controls, lighting systems, and infotainment systems. 5. Medical Devices: The chip's low power consumption and high-performance features make it suitable for medical devices like portable monitoring devices, insulin pumps, and patient monitoring systems.Overall, the R5F211A4DSP#U0 integrated circuit chip offers a combination of low power consumption, small package size, high performance, and rich peripherals, making it suitable for a wide range of applications across various industries.
BU7232SF-E2 Relevant information