LMV762MM/NOPB

LMV762MM/NOPB

Manufacturer No:

LMV762MM/NOPB

Manufacturer:

Texas Instruments

Description:

IC COMPARATOR 2 GEN PUR 8VSSOP

Datasheet:

Datasheet

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LMV762MM/NOPB Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-VSSOP
  • Mounting Type
    Surface Mount
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Operating Temperature
    -40°C ~ 125°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    225ns
  • CMRR, PSRR (Typ)
    100dB CMRR, 110dB PSRR
  • Current - Quiescent (Max)
    700µA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    50pA @ 5V
  • Voltage - Input Offset (Max)
    0.2mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 5V
  • Output Type
    Push-Pull
  • Number of Elements
    2
  • Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The LMV762MM/NOPB is a low voltage, low power operational amplifier integrated circuit chip. Some of its advantages and application scenarios include:Advantages: 1. Low voltage operation: The LMV762MM/NOPB operates at a low supply voltage range of 1.8V to 5.5V, making it suitable for battery-powered applications and low voltage systems. 2. Low power consumption: It has a low quiescent current of 20μA, which helps in reducing power consumption and extending battery life in portable devices. 3. Rail-to-rail input and output: The chip supports rail-to-rail input and output voltage range, allowing it to operate with signals close to the supply rails, maximizing the dynamic range and signal fidelity. 4. Wide bandwidth: It offers a wide bandwidth of 1.4MHz, enabling it to handle high-frequency signals accurately. 5. Small package: The LMV762MM/NOPB comes in a small package (VSSOP-8), making it suitable for space-constrained applications.Application scenarios: 1. Portable devices: The low voltage and low power characteristics of the LMV762MM/NOPB make it ideal for use in portable devices such as smartphones, tablets, and wearable devices. 2. Sensor interfaces: The rail-to-rail input and output capability of the chip make it suitable for sensor interface applications, where accurate amplification of small sensor signals is required. 3. Audio amplification: The wide bandwidth and low power consumption make it suitable for audio amplification applications, such as headphone amplifiers or portable audio devices. 4. Battery-powered systems: The low voltage operation and low power consumption make it suitable for various battery-powered systems, including IoT devices, remote sensors, and wireless communication modules. 5. Industrial and automotive applications: The chip's small package and low voltage operation make it suitable for space-constrained industrial and automotive applications, such as motor control, instrumentation, and control systems.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the overall system design.