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MAX900BEWP

MAX900BEWP

Manufacturer No:

MAX900BEWP

Description:

IC COMPARATOR 4 GEN PUR 20SOIC

Datasheet:

Datasheet

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MAX900BEWP Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Mounting Type
    Surface Mount
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    8ns (Typ)
  • CMRR, PSRR (Typ)
    -82dB, -80dB
  • Current - Quiescent (Max)
    6mA, 12mA, 15mA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    10µA @ 5V
  • Voltage - Input Offset (Max)
    4mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    5V ~ 10V, ±2.5V ~ 5V
  • Output Type
    Push-Pull, TTL
  • Number of Elements
    4
  • Type
    General Purpose
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MAX900BEWP is a precision, low-power, low-offset voltage operational amplifier integrated circuit (IC) chip. Some of its advantages and application scenarios include:1. Low offset voltage: The MAX900BEWP has a very low input offset voltage, which ensures accurate amplification of small signals and minimizes errors in precision applications.2. Low power consumption: This IC chip operates at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Rail-to-rail input and output: The MAX900BEWP supports rail-to-rail input and output voltage range, allowing it to handle signals close to the power supply rails. This feature is beneficial in applications where the full dynamic range of the power supply is required.4. Wide bandwidth: With a wide bandwidth, this IC chip can handle high-frequency signals accurately, making it suitable for applications such as audio amplification, signal conditioning, and data acquisition.5. Small package size: The MAX900BEWP is available in a small package, which makes it suitable for space-constrained applications or designs where multiple amplifiers need to be integrated into a compact form factor.Application scenarios for the MAX900BEWP IC chip include:1. Sensor amplification: The low offset voltage and high precision of the MAX900BEWP make it suitable for amplifying signals from various sensors, such as temperature sensors, pressure sensors, or strain gauges.2. Portable instrumentation: Due to its low power consumption and small package size, the MAX900BEWP is well-suited for portable instrumentation devices like handheld multimeters, portable data loggers, or portable medical devices.3. Audio amplification: The wide bandwidth and rail-to-rail input/output capabilities of the MAX900BEWP make it suitable for audio amplification applications, such as headphone amplifiers, audio mixers, or portable audio devices.4. Industrial control systems: The precision and low offset voltage of the MAX900BEWP make it suitable for use in industrial control systems, such as process control, motor control, or robotics, where accurate signal amplification and conditioning are required.5. Battery-powered devices: The low power consumption of the MAX900BEWP makes it ideal for battery-powered devices, such as wireless sensors, remote monitoring systems, or portable instrumentation, where power efficiency is critical for extended battery life.Overall, the MAX900BEWP IC chip offers high precision, low power consumption, and versatile application scenarios, making it suitable for a wide range of precision amplification and signal conditioning applications.
MAX900BEWP Relevant information