MAX900BCPP

MAX900BCPP

Manufacturer No:

MAX900BCPP

Description:

IC COMPARATOR 4 GEN PUR 20DIP

Datasheet:

Datasheet

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MAX900BCPP Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-PDIP
  • Mounting Type
    Through Hole
  • Package / Case
    20-DIP (0.300", 7.62mm)
  • Operating Temperature
    0°C ~ 70°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    8ns (Typ)
  • CMRR, PSRR (Typ)
    -82dB, -80dB
  • Current - Quiescent (Max)
    6mA, 12mA, 15mA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    10µA @ 5V
  • Voltage - Input Offset (Max)
    4mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    5V ~ 10V, ±2.5V ~ 5V
  • Output Type
    Push-Pull, TTL
  • Number of Elements
    4
  • Type
    General Purpose
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MAX900BCPP is a precision, low-power operational amplifier integrated circuit (IC) chip. Some of its advantages and application scenarios include:1. High Precision: The MAX900BCPP offers high precision with low input offset voltage and low input bias current. This makes it suitable for applications that require accurate amplification and signal conditioning, such as sensor interfaces, data acquisition systems, and instrumentation.2. Low Power Consumption: This IC chip operates at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. It helps in extending the battery life of portable devices and reducing power consumption in energy-sensitive applications.3. Rail-to-Rail Inputs and Outputs: The MAX900BCPP supports rail-to-rail input and output voltage ranges. This feature allows it to handle signals that swing close to the supply rails, maximizing the dynamic range and ensuring accurate amplification of signals in applications such as audio amplifiers and sensor interfaces.4. Wide Supply Voltage Range: The IC chip operates over a wide supply voltage range, typically from 2.7V to 11V. This flexibility enables its usage in various applications with different power supply configurations.5. Small Package Size: The MAX900BCPP is available in a small package, such as a 14-pin DIP (Dual Inline Package) or SOIC (Small Outline Integrated Circuit) package. This compact size makes it suitable for space-constrained applications or designs where miniaturization is a requirement.6. Temperature Stability: The IC chip offers good temperature stability, ensuring consistent performance across a wide temperature range. This makes it suitable for applications that operate in harsh environments or require stable amplification over varying temperatures.Some application scenarios where the MAX900BCPP can be utilized include:1. Sensor Interfaces: The precision and low-power characteristics of the MAX900BCPP make it suitable for amplifying and conditioning signals from various sensors, such as temperature sensors, pressure sensors, or strain gauges.2. Data Acquisition Systems: The IC chip can be used in data acquisition systems to amplify and condition analog signals before digitization. Its precision and low-power consumption make it suitable for accurate and energy-efficient data acquisition.3. Instrumentation and Test Equipment: The MAX900BCPP can be employed in instrumentation and test equipment, such as oscilloscopes, spectrum analyzers, or signal generators. It helps in amplifying and conditioning signals accurately for measurement and analysis purposes.4. Audio Amplifiers: The rail-to-rail input and output capability of the IC chip make it suitable for audio amplification applications, such as headphone amplifiers or portable audio devices.5. Battery-Powered Devices: The low-power consumption of the MAX900BCPP makes it ideal for battery-powered devices, including portable medical devices, handheld instruments, or wireless sensor nodes.Overall, the MAX900BCPP offers precision, low-power operation, and versatile application scenarios, making it a suitable choice for various analog signal amplification and conditioning requirements.