HFA3-0003L-5

HFA3-0003L-5

Manufacturer No:

HFA3-0003L-5

Manufacturer:

Harris Corporation

Description:

IC COMPARATOR 1 GEN PUR 16DIP

Datasheet:

Datasheet

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HFA3-0003L-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Mounting Type
    Through Hole
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Operating Temperature
    0°C ~ 75°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    2.6ns
  • CMRR, PSRR (Typ)
    75dB, 80dB PSRR
  • Current - Quiescent (Max)
    13mA
  • Current - Output (Typ)
    30mA
  • Current - Input Bias (Max)
    5µA @ 5V
  • Voltage - Input Offset (Max)
    3mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    -
  • Output Type
    ECL
  • Number of Elements
    1
  • Type
    General Purpose
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The HFA3-0003L-5 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Frequency Operation: These chips are designed to operate at high frequencies, typically in the range of several GHz. This makes them suitable for applications that require fast signal processing and high-speed data transmission.2. Low Power Consumption: The HFA3-0003L-5 chips are designed to consume low power, making them suitable for battery-powered devices or applications where power efficiency is crucial.3. Small Form Factor: These chips are available in small package sizes, which makes them suitable for compact and space-constrained applications.4. Wide Operating Voltage Range: The HFA3-0003L-5 chips can operate over a wide range of supply voltages, typically from 2.7V to 5.5V. This flexibility allows them to be used in various voltage domains and power supply configurations.Application Scenarios: 1. Wireless Communication Systems: The high-frequency operation and low power consumption of these chips make them suitable for wireless communication systems such as Wi-Fi, Bluetooth, and Zigbee. They can be used in transceivers, amplifiers, and filters for signal processing and transmission.2. Radar Systems: The high-frequency operation and small form factor of these chips make them suitable for radar systems. They can be used in radar transmitters, receivers, and signal processing units for target detection, tracking, and imaging.3. Test and Measurement Equipment: The high-frequency operation and low power consumption of these chips make them suitable for test and measurement equipment such as oscilloscopes, spectrum analyzers, and signal generators. They can be used in signal conditioning, amplification, and filtering circuits.4. Medical Devices: The small form factor and low power consumption of these chips make them suitable for medical devices such as portable monitors, implantable devices, and diagnostic equipment. They can be used in signal processing, data acquisition, and wireless communication modules.5. Automotive Electronics: The high-frequency operation and wide operating voltage range of these chips make them suitable for automotive electronics. They can be used in applications such as collision avoidance systems, radar-based adaptive cruise control, and vehicle-to-vehicle communication.Overall, the HFA3-0003L-5 integrated circuit chips offer advantages in terms of high-frequency operation, low power consumption, small form factor, and wide operating voltage range, making them suitable for various applications in wireless communication, radar systems, test and measurement equipment, medical devices, and automotive electronics.