HFA3-0003L-9
Manufacturer No:
HFA3-0003L-9
Manufacturer:
Description:
IC COMPARATOR 1 GEN PUR 16DIP
Datasheet:
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In Stock : 651
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HFA3-0003L-9 Specifications
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TypeParameter
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Supplier Device Package16-PDIP
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Mounting TypeThrough Hole
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Package / Case16-DIP (0.300", 7.62mm)
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Operating Temperature-40°C ~ 85°C
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Hysteresis-
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Propagation Delay (Max)2.6ns
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CMRR, PSRR (Typ)75dB, 80dB PSRR
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Current - Quiescent (Max)13mA
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Current - Output (Typ)30mA
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Current - Input Bias (Max)5µA @ 5V
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Voltage - Input Offset (Max)3mV @ 5V
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Voltage - Supply, Single/Dual (±)-
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Output TypeECL
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Number of Elements1
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TypeGeneral Purpose
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PackagingBulk
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Product StatusObsolete
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Series-
The HFA3-0003L-9 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Frequency Operation: These chips are designed to operate at high frequencies, typically in the range of several GHz. This makes them suitable for applications that require fast signal processing and high-speed data transmission.2. Low Power Consumption: The HFA3-0003L-9 chips are designed to consume low power, making them suitable for battery-powered devices or applications where power efficiency is crucial.3. Small Form Factor: These chips are available in small package sizes, which makes them suitable for compact and space-constrained applications.4. Wide Operating Voltage Range: The HFA3-0003L-9 chips can operate over a wide voltage range, typically from 2.7V to 5.5V. This flexibility allows them to be used in various voltage supply environments.Application Scenarios: 1. Wireless Communication Systems: The high-frequency operation and low power consumption of these chips make them suitable for wireless communication systems such as Wi-Fi, Bluetooth, or Zigbee. They can be used in transceivers, modems, or RF front-end circuits.2. Radar Systems: The high-frequency operation and small form factor of these chips make them suitable for radar systems. They can be used in radar transmitters, receivers, or signal processing units.3. Test and Measurement Equipment: The high-frequency operation and low power consumption of these chips make them suitable for test and measurement equipment such as oscilloscopes, spectrum analyzers, or signal generators. They can be used in high-speed data acquisition, signal processing, or signal conditioning circuits.4. Medical Devices: The small form factor and low power consumption of these chips make them suitable for medical devices such as portable monitors, implantable devices, or diagnostic equipment. They can be used in data acquisition, signal processing, or wireless communication modules.5. Automotive Electronics: The high-frequency operation and wide operating voltage range of these chips make them suitable for automotive electronics. They can be used in applications such as collision avoidance systems, radar-based sensors, or infotainment systems.Overall, the HFA3-0003L-9 integrated circuit chips offer advantages in terms of high-frequency operation, low power consumption, small form factor, and wide operating voltage range, making them suitable for various applications in wireless communication, radar systems, test and measurement equipment, medical devices, and automotive electronics.
HFA3-0003L-9 Relevant information