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CA0139AF

CA0139AF

Manufacturer No:

CA0139AF

Manufacturer:

Harris Corporation

Description:

IC COMPARATOR 4 GEN PUR 14CERDIP

Datasheet:

Datasheet

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CA0139AF Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-CERDIP
  • Mounting Type
    Through Hole
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Operating Temperature
    -55°C ~ 125°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    -
  • CMRR, PSRR (Typ)
    -
  • Current - Quiescent (Max)
    2mA
  • Current - Output (Typ)
    16mA
  • Current - Input Bias (Max)
    0.025µA @ 5V
  • Voltage - Input Offset (Max)
    2mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    36V, ±18V
  • Output Type
    Open-Collector, CMOS, DTL, ECL, MOS, TTL
  • Number of Elements
    4
  • Type
    General Purpose
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The CA0139AF integrated circuit chips, also known as the Sound Core3D chips, have several advantages and application scenarios. Here are some of them:Advantages: 1. High-Quality Audio: The CA0139AF chips provide high-quality audio processing capabilities, enabling superior sound reproduction and enhanced audio experiences. 2. Advanced Audio Technologies: These chips incorporate advanced audio technologies such as THX TruStudio Pro, CrystalVoice, and Scout Mode, which enhance audio effects, noise cancellation, and voice communication. 3. Low Power Consumption: The CA0139AF chips are designed to operate efficiently with low power consumption, making them suitable for portable devices and battery-powered applications. 4. Integration: These chips integrate multiple audio processing functions into a single chip, reducing the need for additional components and simplifying the overall design of audio systems. 5. Customizability: The CA0139AF chips offer programmable features and customizable settings, allowing manufacturers and developers to tailor the audio processing to specific requirements.Application Scenarios: 1. Gaming Consoles: The CA0139AF chips are commonly used in gaming consoles to provide immersive audio experiences, enhance in-game sound effects, and enable clear voice communication during multiplayer gaming. 2. Sound Cards: These chips are widely used in sound cards for desktop computers, offering high-fidelity audio playback, advanced audio effects, and noise cancellation capabilities. 3. Headsets and Speakers: The CA0139AF chips can be integrated into headsets and speakers to enhance audio quality, provide virtual surround sound, and improve voice communication. 4. Portable Media Players: These chips are suitable for portable media players, enabling high-quality audio playback, audio effects, and noise reduction for an enhanced listening experience. 5. Automotive Infotainment Systems: The CA0139AF chips can be used in automotive infotainment systems to deliver superior audio quality, noise cancellation, and voice recognition capabilities.Overall, the CA0139AF integrated circuit chips offer advanced audio processing capabilities, making them suitable for various applications where high-quality audio, customization, and power efficiency are required.
CA0139AF Relevant information