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LT6700IDCB-1#TRMPBF

LT6700IDCB-1#TRMPBF

Manufacturer No:

LT6700IDCB-1#TRMPBF

Manufacturer:

Analog Devices Inc.

Description:

IC COMPARATOR 2 W/VOLT REF 6DFN

Datasheet:

Datasheet

Delivery:

Payment:

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LT6700IDCB-1#TRMPBF Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-DFN (2x3)
  • Mounting Type
    Surface Mount
  • Package / Case
    6-WFDFN Exposed Pad
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    11.5mV
  • Propagation Delay (Max)
    29µs
  • CMRR, PSRR (Typ)
    -
  • Current - Quiescent (Max)
    17µA
  • Current - Output (Typ)
    -
  • Current - Input Bias (Max)
    0.01µA @ 18V
  • Voltage - Input Offset (Max)
    -
  • Voltage - Supply, Single/Dual (±)
    1.4V ~ 18V
  • Output Type
    Open-Collector
  • Number of Elements
    2
  • Type
    with Voltage Reference
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Over-The-Top®
The DSPIC33EP512MC502-H/SO integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33EP512MC502-H/SO chips are designed to deliver high performance with a 70 MIPS (Million Instructions Per Second) performance and a 16-bit microcontroller core. This makes them suitable for applications that require fast and efficient processing.2. Digital Signal Processing (DSP) Capabilities: These chips are specifically designed for applications that require DSP capabilities. They have a wide range of built-in DSP instructions and peripherals, making them suitable for applications such as audio processing, motor control, and digital filters.3. Integrated Peripherals: The chips come with a wide range of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration reduces the need for external components, simplifies the design, and saves board space.4. Low Power Consumption: The DSPIC33EP512MC502-H/SO chips are designed to operate at low power, making them suitable for battery-powered applications or applications that require energy efficiency.Application Scenarios: 1. Motor Control: The DSPIC33EP512MC502-H/SO chips are commonly used in motor control applications, such as industrial motor drives, robotics, and automotive systems. The high-performance DSP capabilities and integrated peripherals make them suitable for precise and efficient motor control.2. Audio Processing: These chips can be used in audio processing applications, such as audio effects processors, audio mixers, and digital audio amplifiers. The DSP capabilities and integrated ADCs/DACs enable high-quality audio processing and playback.3. Power Electronics: The chips can be applied in power electronics applications, such as power inverters, power supplies, and renewable energy systems. The high-performance processing and integrated peripherals allow for efficient power conversion and control.4. Communication Systems: The DSPIC33EP512MC502-H/SO chips can be used in communication systems, such as wireless communication modules, IoT devices, and data loggers. The integrated peripherals, including UARTs, SPI, and I2C, enable seamless communication with other devices.5. Medical Devices: These chips can be applied in medical devices, such as patient monitoring systems, medical imaging equipment, and diagnostic devices. The high-performance processing and integrated peripherals allow for real-time data processing and accurate measurements.Overall, the DSPIC33EP512MC502-H/SO integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, and low power consumption, making them suitable for a wide range of applications in various industries.
LT6700IDCB-1#TRMPBF Relevant information