Home / Comparators / TLV7211ID/
TLV7211ID

TLV7211ID

Manufacturer No:

TLV7211ID

Manufacturer:

Texas Instruments

Description:

IC COMPARATOR 1 GEN PUR 8SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

TLV7211ID Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Operating Temperature
    -40°C ~ 85°C
  • Hysteresis
    -
  • Propagation Delay (Max)
    10µs
  • CMRR, PSRR (Typ)
    75dB CMRR, 80dB PSRR
  • Current - Quiescent (Max)
    18µA
  • Current - Output (Typ)
    30mA
  • Current - Input Bias (Max)
    0.04pA @ 5V
  • Voltage - Input Offset (Max)
    15mV @ 5V
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 15V
  • Output Type
    Push-Pull
  • Number of Elements
    1
  • Type
    General Purpose
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The DSPIC33EP64GS502T-E/MM integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33EP64GS502T-E/MM chips are designed to deliver high performance with a 70 MIPS (Million Instructions Per Second) performance and a 16-bit microcontroller core. This makes them suitable for applications that require fast and efficient processing.2. Digital Signal Processing (DSP) Capabilities: These chips are specifically designed for applications that require DSP capabilities. They have a wide range of built-in DSP instructions and peripherals, making them ideal for applications such as audio processing, motor control, and digital filters.3. Integrated Peripherals: The chips come with a variety of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. This integration reduces the need for external components, simplifying the design and reducing the overall cost.4. Low Power Consumption: The DSPIC33EP64GS502T-E/MM chips are designed to operate at low power, making them suitable for battery-powered applications or applications that require energy efficiency.Application Scenarios: 1. Motor Control: The DSPIC33EP64GS502T-E/MM chips are commonly used in motor control applications, such as controlling the speed and direction of motors in robotics, industrial automation, and electric vehicles. The DSP capabilities and integrated peripherals make them well-suited for precise motor control.2. Audio Processing: These chips can be used in audio processing applications, such as audio effects processors, audio mixers, and audio amplifiers. The DSP capabilities allow for real-time audio processing and the integrated peripherals simplify the design of audio interfaces.3. Power Electronics: The chips can be applied in power electronics applications, such as power inverters, power supplies, and power factor correction. The high-performance processing and integrated peripherals enable efficient control and monitoring of power electronics systems.4. Industrial Automation: The DSPIC33EP64GS502T-E/MM chips can be used in various industrial automation applications, including PLCs (Programmable Logic Controllers), process control systems, and monitoring systems. The high-performance processing and integrated peripherals enable real-time control and monitoring of industrial processes.5. Medical Devices: These chips can be applied in medical devices, such as patient monitoring systems, medical imaging equipment, and diagnostic devices. The low power consumption and DSP capabilities make them suitable for portable and battery-powered medical devices.Overall, the DSPIC33EP64GS502T-E/MM integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, and low power consumption, making them suitable for a wide range of applications in various industries.
TLV7211ID Relevant information