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HFA1109IP

HFA1109IP

Manufacturer No:

HFA1109IP

Manufacturer:

Intersil

Description:

VIDEO OPERATIONAL AMPLIFIER

Datasheet:

Datasheet

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HFA1109IP Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-PDIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Voltage - Supply, Single/Dual (±)
    ±4.5V ~ 5.5V
  • Current - Output / Channel
    36 mA
  • Current - Supply
    9.6 mA
  • Slew Rate
    2600V/µs
  • -3db Bandwidth
    450 MHz
  • Number of Circuits
    1
  • Output Type
    -
  • Applications
    Current Feedback
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XE164F24F66LACFXUMA1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the XE166 architecture, which offers high processing power and performance. 2. Integrated Peripherals: They come with a wide range of integrated peripherals such as timers, UARTs, SPI, CAN, ADC, and PWM, which reduce the need for external components. 3. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications. 4. Robust Communication Interfaces: They support various communication interfaces like CAN, LIN, and UART, enabling seamless connectivity with other devices. 5. Enhanced Security: These chips come with built-in security features like memory protection unit (MPU) and hardware encryption, ensuring data integrity and protection against unauthorized access.Application Scenarios: 1. Industrial Automation: The XE164F24F66LACFXUMA1 chips are suitable for industrial automation applications like motor control, robotics, and process control systems. 2. Automotive Electronics: With their robust communication interfaces and high-performance capabilities, these chips can be used in automotive applications such as engine control units (ECUs), body control modules (BCMs), and advanced driver-assistance systems (ADAS). 3. Smart Grids: These chips can be utilized in smart grid systems for monitoring and controlling power distribution, ensuring efficient energy management. 4. Home Automation: The chips can be integrated into home automation systems for controlling and managing various devices like lighting, HVAC, and security systems. 5. Internet of Things (IoT): With their low power consumption and integrated peripherals, these chips are suitable for IoT applications like sensor nodes, smart meters, and wearable devices.Overall, the XE164F24F66LACFXUMA1 integrated circuit chips offer high performance, low power consumption, and a wide range of integrated peripherals, making them suitable for various industrial, automotive, and IoT applications.
HFA1109IP Relevant information