ISL59444IBZ-T13

ISL59444IBZ-T13

Manufacturer No:

ISL59444IBZ-T13

Description:

IC AMP MPLEX AMP 16SOIC

Datasheet:

Datasheet

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ISL59444IBZ-T13 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    ±4.5V ~ 5.5V
  • Current - Output / Channel
    180 mA
  • Current - Supply
    18 mA
  • Slew Rate
    1515V/µs
  • -3db Bandwidth
    1 GHz
  • Number of Circuits
    1
  • Output Type
    -
  • Applications
    4:1 Multiplexer-Amplifier
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The XE164G24F66LACFXQMA1 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the XE166 architecture, which offers high processing power and performance. 2. Integrated Peripherals: They come with a wide range of integrated peripherals such as timers, UARTs, SPI, CAN, ADC, and PWM, which reduce the need for external components. 3. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications. 4. Robust Communication Interfaces: They support various communication interfaces like CAN, LIN, and UART, enabling seamless connectivity with other devices. 5. Enhanced Security: These chips come with built-in security features like memory protection, encryption, and tamper detection, ensuring data integrity and system security.Application Scenarios: 1. Industrial Automation: The XE164G24F66LACFXQMA1 chips are suitable for industrial automation applications like motor control, robotics, and factory automation due to their high performance and integrated peripherals. 2. Automotive Electronics: With their robust communication interfaces and security features, these chips are ideal for automotive applications such as engine control units (ECUs), body control modules (BCMs), and advanced driver-assistance systems (ADAS). 3. Smart Grids: The chips can be used in smart grid applications for power management, energy monitoring, and control systems. 4. Home Automation: These chips can be utilized in home automation systems for controlling and monitoring various devices like lighting, HVAC, and security systems. 5. Internet of Things (IoT): Due to their low power consumption and integrated peripherals, these chips are suitable for IoT applications like sensor nodes, smart meters, and wearable devices.Overall, the XE164G24F66LACFXQMA1 integrated circuit chips offer high performance, low power consumption, and a wide range of integrated peripherals, making them suitable for various industrial, automotive, and IoT applications.