EL5824IRE-T13

EL5824IRE-T13

Manufacturer No:

EL5824IRE-T13

Description:

IC AMP TFT-LCD 28TSSOP

Datasheet:

Datasheet

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EL5824IRE-T13 Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-HTSSOP
  • Package / Case
    28-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    4.5V ~ 16.5V, ±2.25V ~ 8.25V
  • Current - Output / Channel
    140 mA
  • Current - Supply
    9.5 mA
  • Slew Rate
    15V/µs
  • -3db Bandwidth
    12 MHz
  • Number of Circuits
    10
  • Output Type
    Rail-to-Rail
  • Applications
    TFT-LCD Panels: Gamma Buffer, VCOM Driver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The EL5824IRE-T13 is an integrated circuit chip designed for high-speed, low-power, and low-voltage applications. Some of its advantages and application scenarios include:1. High-speed data transmission: The EL5824IRE-T13 chip supports data rates up to 2.5 Gbps, making it suitable for high-speed communication systems such as fiber-optic networks, high-speed serial links, and data centers.2. Low power consumption: The chip is designed to operate at low power levels, making it ideal for battery-powered devices or applications where power efficiency is crucial.3. Low-voltage operation: The EL5824IRE-T13 chip operates at low supply voltages, typically between 3.3V and 5V, making it compatible with a wide range of electronic systems.4. Differential signaling: The chip supports differential signaling, which provides better noise immunity and signal integrity, making it suitable for applications where noise rejection is critical, such as high-speed data transmission over long distances.5. Wide temperature range: The EL5824IRE-T13 chip is designed to operate over a wide temperature range, typically from -40°C to 85°C, making it suitable for industrial and automotive applications.6. Small form factor: The chip comes in a compact package, making it suitable for space-constrained applications or designs where miniaturization is required.Application scenarios for the EL5824IRE-T13 chip include:1. Fiber-optic communication systems: The chip can be used in transceivers, optical modules, or other components of fiber-optic communication systems to enable high-speed data transmission.2. High-speed serial links: The chip can be used in applications that require high-speed serial data transmission, such as high-definition video streaming, storage area networks, or computer peripherals.3. Data centers: The chip can be used in networking equipment, servers, or storage systems within data centers to enable high-speed data communication between different components.4. Industrial automation: The chip can be used in industrial control systems, robotics, or sensor networks to enable high-speed data transmission and communication between different devices.5. Automotive electronics: The chip can be used in automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), or in-vehicle networking to enable high-speed data communication and connectivity.Overall, the EL5824IRE-T13 chip's advantages of high-speed, low-power, low-voltage operation, and wide temperature range make it suitable for various applications requiring high-speed data transmission and communication.