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BUF16820AIDAPR

BUF16820AIDAPR

Manufacturer No:

BUF16820AIDAPR

Manufacturer:

Texas Instruments

Description:

IC AMP TFT-LCD 32HTSSOP

Datasheet:

Datasheet

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BUF16820AIDAPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    32-HTSSOP
  • Package / Case
    32-PowerTSSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    8.5V ~ 18V
  • Current - Supply
    18 mA
  • Slew Rate
    -
  • -3db Bandwidth
    -
  • Number of Circuits
    14
  • Output Type
    Rail-to-Rail
  • Applications
    TFT-LCD Panels: Gamma Buffer, VCOM Driver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The DSPIC33CH512MP206T-I/MR integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips are based on the dsPIC33CH core, which offers high performance and efficient execution of complex algorithms. 2. Dual Core Architecture: The chips feature a dual-core architecture with a master core and a slave core, allowing for parallel processing and improved performance. 3. Rich Peripheral Set: They come with a rich set of peripherals, including multiple UART, SPI, I2C, and PWM modules, which enable easy interfacing with various external devices. 4. Enhanced Connectivity: The chips support various communication protocols like CAN, Ethernet, and USB, enabling seamless connectivity with other devices and networks. 5. High Memory Capacity: They have a large program memory and data memory capacity, allowing for the implementation of complex applications and algorithms. 6. Low Power Consumption: The chips are designed to operate at low power, making them suitable for battery-powered applications.Application Scenarios: 1. Industrial Automation: The chips can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication with other devices. 2. Power Electronics: They are suitable for power electronics applications such as inverters, converters, and power supplies, where high-performance control algorithms are required. 3. Automotive Systems: The chips can be used in automotive systems for tasks like engine control, dashboard display, and communication with other vehicle modules. 4. Internet of Things (IoT): They are well-suited for IoT applications, where they can be used for sensor data processing, connectivity, and control functions. 5. Medical Devices: The chips can be utilized in medical devices for tasks like signal processing, control, and communication with other medical equipment. 6. Consumer Electronics: They can be used in various consumer electronics applications like home automation, smart appliances, and multimedia devices, where high-performance processing is required.Overall, the DSPIC33CH512MP206T-I/MR integrated circuit chips offer high performance, rich peripherals, and connectivity options, making them suitable for a wide range of applications in different industries.
BUF16820AIDAPR Relevant information