Home / Video Amps and Modules / MAX4448ESE/
MAX4448ESE

MAX4448ESE

Manufacturer No:

MAX4448ESE

Description:

IC AMP DRIVER 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

MAX4448ESE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    ±4.5V ~ 5.5V
  • Current - Output / Channel
    130 mA
  • Current - Supply
    46 mA
  • Slew Rate
    4300V/µs
  • -3db Bandwidth
    330 MHz
  • Number of Circuits
    1
  • Output Type
    Differential
  • Applications
    Driver
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DSPIC33EP256GM706T-I/MR integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios are:Advantages: 1. High Performance: The DSPIC33EP256GM706T-I/MR chips are designed to deliver high performance with a 70 MIPS (Million Instructions Per Second) performance and a 16-bit microcontroller core. This makes them suitable for applications that require fast and efficient processing.2. Digital Signal Processing (DSP) Capabilities: These chips are specifically designed for digital signal processing applications. They offer a wide range of DSP features, such as multiply-accumulate (MAC) units, hardware support for division, and advanced math functions. This makes them ideal for applications that involve audio processing, motor control, and other signal processing tasks.3. Integrated Peripherals: The chips come with a variety of integrated peripherals, including multiple UART, SPI, and I2C communication interfaces, analog-to-digital converters (ADCs), and pulse-width modulation (PWM) modules. These integrated peripherals simplify the design process and reduce the need for external components, making them suitable for applications that require multiple communication interfaces and analog signal processing.4. Low Power Consumption: The DSPIC33EP256GM706T-I/MR chips are designed to operate at low power, making them suitable for battery-powered applications or applications that require energy efficiency.Application Scenarios: 1. Motor Control: The DSPIC33EP256GM706T-I/MR chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. The high-performance DSP capabilities and integrated peripherals make them suitable for controlling and driving motors with precision and efficiency.2. Audio Processing: These chips can be used in audio processing applications, such as audio effects processors, audio mixers, and digital audio amplifiers. The DSP capabilities and integrated peripherals allow for real-time audio processing and manipulation.3. Power Electronics: The chips can be applied in power electronics applications, such as power inverters, uninterruptible power supplies (UPS), and solar inverters. The high-performance DSP capabilities and integrated peripherals enable precise control and monitoring of power conversion processes.4. Communication Systems: The DSPIC33EP256GM706T-I/MR chips can be used in communication systems, such as wireless sensor networks, IoT devices, and data communication modules. The integrated communication interfaces and low power consumption make them suitable for transmitting and receiving data in various communication protocols.Overall, the DSPIC33EP256GM706T-I/MR integrated circuit chips offer high performance, DSP capabilities, integrated peripherals, and low power consumption, making them suitable for a wide range of applications in motor control, audio processing, power electronics, and communication systems.
MAX4448ESE Relevant information