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BUF08630RGWR

BUF08630RGWR

Manufacturer No:

BUF08630RGWR

Manufacturer:

Texas Instruments

Description:

IC AMP TFT-LCD 20VQFN

Datasheet:

Datasheet

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BUF08630RGWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-VQFN (5x5)
  • Package / Case
    20-VQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    9V ~ 20V
  • Current - Output / Channel
    300 mA
  • Current - Supply
    940 µA
  • Slew Rate
    45V/µs
  • -3db Bandwidth
    -
  • Number of Circuits
    8
  • Output Type
    Rail-to-Rail
  • Applications
    TFT-LCD Panels: VCOM Driver
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The DSPIC33EP16GS502-I/MM integrated circuit chip has several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The DSPIC33EP16GS502-I/MM chip is built with a high-performance 16-bit architecture that allows for efficient and fast signal processing. It offers a high instruction execution speed and powerful computational capabilities.2. Integrated Peripherals: The chip includes a wide range of integrated peripherals such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UART, SPI, I2C, and PWM modules. This integration helps in reducing the overall system complexity and cost.3. Enhanced Connectivity: The chip provides multiple communication interfaces like UART, SPI, and I2C, enabling seamless connectivity with other devices or microcontrollers. This makes it suitable for applications requiring communication and data transfer.4. Low Power Consumption: The DSPIC33EP16GS502-I/MM chip is designed with power-saving features and supports various power modes. It offers efficient power management, making it ideal for battery-powered applications or those requiring low power consumption.5. Rich Development Tools: Microchip, the manufacturer of DSPIC33EP16GS502-I/MM, provides a comprehensive set of development tools, software libraries, and application notes to aid in the design and development process. This facilitates faster prototyping, testing, and optimization.Application Scenarios: 1. Motor Control: The DSPIC33EP16GS502-I/MM chip's high-performance architecture and integrated PWM modules make it suitable for motor control applications. It can be used in areas like robotics, industrial automation, and electric vehicle control.2. Power Electronics: The chip's capability to handle fast signal processing and its integrated peripherals like ADCs and DACs make it suitable for power electronics applications. It can be used in areas such as power inverters, power supplies, and renewable energy systems.3. Communication Systems: With its integrated communication interfaces, the chip can be utilized in various communication systems such as wireless sensor networks, IoT devices, and home automation systems.4. Consumer Electronics: The chip's high-performance architecture, low power consumption, and integrated peripherals make it suitable for consumer electronics applications like smart appliances, wearable devices, and audio/video processing.5. Industrial Control: The DSPIC33EP16GS502-I/MM chip can be employed in industrial control systems where real-time signal processing, precise timing, and communication capabilities are required. It can be used in areas like PLCs (Programmable Logic Controllers), process automation, and industrial monitoring systems.It is important to note that the chip's specific application will depend on the requirements of the project and the surrounding system architecture.
BUF08630RGWR Relevant information