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THS7319IZSVR

THS7319IZSVR

Manufacturer No:

THS7319IZSVR

Manufacturer:

Texas Instruments

Description:

IC AMP BUFFER 9UCSP

Datasheet:

Datasheet

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THS7319IZSVR Specifications

  • Type
    Parameter
  • Supplier Device Package
    9-UCSP (1.5x1.5)
  • Package / Case
    9-XFBGA, CSPBGA
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    2.5V ~ 5.5V
  • Current - Output / Channel
    70 mA
  • Current - Supply
    3.4 mA
  • Slew Rate
    80V/µs
  • -3db Bandwidth
    20 MHz
  • Number of Circuits
    3
  • Output Type
    Rail-to-Rail
  • Applications
    Buffer
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The THS7319IZSVR is a high-performance integrated circuit chip designed for audio applications. Some of its advantages and application scenarios include:1. High-quality audio performance: The THS7319IZSVR offers excellent audio performance with low distortion and noise, making it suitable for high-fidelity audio systems.2. Wide bandwidth: It has a wide bandwidth of up to 100 MHz, allowing it to handle a broad range of audio frequencies accurately.3. Multiple channels: The chip supports multiple channels, typically up to 8 channels, making it suitable for multi-channel audio systems like home theaters or surround sound setups.4. Low power consumption: The THS7319IZSVR is designed to operate with low power consumption, making it suitable for portable audio devices or battery-powered applications.5. Small form factor: The chip comes in a small package, making it easy to integrate into compact audio systems or devices with limited space.6. Adjustable gain: It offers adjustable gain settings, allowing users to control the amplification level according to their requirements.7. Audio signal conditioning: The THS7319IZSVR provides signal conditioning features like filtering, amplification, and buffering, making it suitable for audio signal processing applications.Application scenarios for the THS7319IZSVR include:1. Home audio systems: The chip can be used in stereo or multi-channel audio systems to amplify and condition audio signals for high-quality sound reproduction.2. Professional audio equipment: It can be used in professional audio equipment like mixers, amplifiers, or audio interfaces to enhance audio signals and maintain signal integrity.3. Automotive audio systems: The THS7319IZSVR can be used in car audio systems to amplify and process audio signals for improved sound quality.4. Portable audio devices: It is suitable for portable audio devices like smartphones, tablets, or portable media players, where low power consumption and small form factor are essential.5. Gaming consoles: The chip can be used in gaming consoles or gaming headsets to provide high-quality audio output for an immersive gaming experience.Overall, the THS7319IZSVR integrated circuit chip offers high-performance audio capabilities and finds applications in various audio systems and devices.
THS7319IZSVR Relevant information