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THS7316DG4

THS7316DG4

Manufacturer No:

THS7316DG4

Manufacturer:

Texas Instruments

Description:

IC AMP BUFFER 8SOIC

Datasheet:

Datasheet

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THS7316DG4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    2.85V ~ 5.5V
  • Current - Output / Channel
    90 mA
  • Current - Supply
    19.3 mA
  • Slew Rate
    -
  • -3db Bandwidth
    36 MHz
  • Number of Circuits
    3
  • Output Type
    Rail-to-Rail
  • Applications
    Buffer
  • Packaging
    Tube
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The R5F564MJHDFC#11 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: These chips are designed to deliver high processing power and performance, making them suitable for demanding applications. 2. Low power consumption: They are optimized for low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. 3. Rich peripheral set: The chips come with a wide range of built-in peripherals, such as timers, UART, I2C, SPI, ADC, and more, providing flexibility and reducing the need for external components. 4. Secure: They offer built-in security features like memory protection units, data encryption, and tamper detection, ensuring the safety and integrity of sensitive data. 5. Scalability: These chips are part of a scalable family of microcontrollers, allowing for easy migration to higher or lower-end devices within the same series.Application Scenarios: 1. Industrial automation: The R5F564MJHDFC#11 chips can be used in industrial automation systems, such as PLCs (Programmable Logic Controllers), motor control units, and robotics, where high performance, low power consumption, and secure operation are essential. 2. Internet of Things (IoT): With their low power consumption and rich peripheral set, these chips are suitable for IoT applications like smart home devices, wearable technology, and sensor nodes. 3. Automotive: The chips can be utilized in automotive applications, including engine control units, body control modules, and advanced driver-assistance systems (ADAS), where high performance, security, and scalability are required. 4. Consumer electronics: These chips can be used in various consumer electronic devices like smart appliances, gaming consoles, and audio/video equipment, where a balance between performance, power consumption, and security is crucial. 5. Medical devices: The chips can find applications in medical devices like patient monitoring systems, portable medical equipment, and diagnostic devices, where reliability, low power consumption, and secure operation are vital.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project or product being developed.
THS7316DG4 Relevant information