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BUF11702PWPR

BUF11702PWPR

Manufacturer No:

BUF11702PWPR

Manufacturer:

Texas Instruments

Description:

IC AMP TFT-LCD 28HTSSOP

Datasheet:

Datasheet

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BUF11702PWPR Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-HTSSOP
  • Package / Case
    28-PowerTSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    4.5V ~ 16V
  • Current - Supply
    2.5 mA
  • Slew Rate
    1V/µs
  • -3db Bandwidth
    1 MHz
  • Number of Circuits
    10
  • Output Type
    Rail-to-Rail
  • Applications
    TFT-LCD Panels: Gamma Buffer, VCOM Driver
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The DSPIC33CH256MP506-I/PT integrated circuit chip is a high-performance digital signal controller (DSC) designed by Microchip Technology. It offers several advantages and can be applied in various scenarios. Here are some of its key advantages and application scenarios:Advantages: 1. High Performance: The DSPIC33CH256MP506-I/PT chip combines the features of a microcontroller and a digital signal processor, providing high computational power and performance for demanding applications. 2. Dual Core Architecture: It features a dual-core architecture with a master core (MCU) and a slave core (DSP), allowing for efficient parallel processing and improved system performance. 3. Rich Peripherals: The chip offers a wide range of integrated peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, communication interfaces (UART, SPI, I2C), and more, enabling easy integration with external devices. 4. Enhanced Connectivity: It supports various communication protocols like Ethernet, USB, CAN, and LIN, making it suitable for applications requiring connectivity and communication capabilities. 5. Low Power Consumption: The chip incorporates power-saving features like multiple power modes, sleep modes, and peripheral module disable, enabling efficient power management and extending battery life in portable applications.Application Scenarios: 1. Industrial Automation: The DSPIC33CH256MP506-I/PT chip can be used in industrial automation systems for tasks like motor control, power conversion, sensor interfacing, and communication with other devices. 2. Automotive Electronics: It is suitable for automotive applications such as engine control units (ECUs), body control modules (BCMs), and advanced driver-assistance systems (ADAS), where high-performance processing and connectivity are required. 3. Power Electronics: The chip's dual-core architecture and rich peripheral set make it ideal for power electronics applications like inverters, power supplies, and battery management systems, enabling precise control and monitoring. 4. Medical Devices: It can be utilized in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices, where real-time signal processing and connectivity are crucial. 5. Consumer Electronics: The chip's high-performance capabilities and connectivity options make it suitable for consumer electronics applications like smart home devices, wearable devices, and audio/video processing systems.These are just a few examples of the advantages and application scenarios of the DSPIC33CH256MP506-I/PT integrated circuit chip. Its versatility and performance make it a popular choice for a wide range of embedded system applications.
BUF11702PWPR Relevant information