Home / Video Amps and Modules / BGD702N,112/
BGD702N,112

BGD702N,112

Manufacturer No:

BGD702N,112

Manufacturer:

NXP USA Inc.

Description:

IC AMP CATV SOT115J

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

BGD702N,112 Specifications

  • Type
    Parameter
  • Voltage - Supply, Single/Dual (±)
    -
  • Slew Rate
    -
  • -3db Bandwidth
    -
  • Number of Circuits
    1
  • Output Type
    -
  • Supplier Device Package
    SOT115J
  • Package / Case
    SOT-115J
  • Mounting Type
    Chassis Mount
  • Current - Supply
    435 mA
  • Applications
    CATV
  • Packaging
    Bulk
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The DSPIC30F3013T-20I/ML integrated circuit chip is a member of the dsPIC30F family of digital signal controllers (DSCs) manufactured by Microchip Technology. Here are some advantages and application scenarios of this particular chip:Advantages: 1. High-performance processing: The dsPIC30F3013T-20I/ML chip is based on a 16-bit architecture and offers a high level of processing power, making it suitable for demanding applications that require real-time signal processing.2. Digital Signal Processing (DSP) capabilities: As a DSC, this chip is specifically designed for DSP applications. It includes a wide range of DSP instructions and features, such as multiply-accumulate (MAC) units, which enable efficient execution of DSP algorithms.3. Integrated peripherals: The chip incorporates various peripherals, including analog-to-digital converters (ADCs), digital-to-analog converters (DACs), timers, UARTs, SPI, I2C, and more. These integrated peripherals simplify system design and reduce the need for external components.4. Low power consumption: The dsPIC30F3013T-20I/ML chip is designed to operate at low power, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Motor control: The dsPIC30F3013T-20I/ML chip is commonly used in motor control applications, such as brushless DC (BLDC) motor control, stepper motor control, and servo motor control. Its high-performance processing and integrated peripherals make it well-suited for these applications.2. Power electronics: The chip can be used in power electronics applications, including power inverters, power supplies, and power factor correction (PFC) circuits. Its DSP capabilities enable efficient control and regulation of power electronics systems.3. Audio processing: The dsPIC30F3013T-20I/ML chip can be utilized in audio processing applications, such as audio effects processors, audio synthesis, and audio amplifiers. Its DSP instructions and integrated peripherals make it suitable for real-time audio signal processing.4. Industrial automation: The chip can be employed in various industrial automation applications, including robotics, process control, and monitoring systems. Its high-performance processing and integrated peripherals enable precise control and monitoring of industrial processes.5. Communication systems: The dsPIC30F3013T-20I/ML chip can be used in communication systems, such as wireless communication devices, modems, and data acquisition systems. Its integrated peripherals, including UARTs, SPI, and I2C, facilitate communication with external devices.Overall, the dsPIC30F3013T-20I/ML chip offers high-performance DSP capabilities, integrated peripherals, and low power consumption, making it suitable for a wide range of applications requiring real-time signal processing and control.
BGD702N,112 Relevant information