MAX4090AAUT+

MAX4090AAUT+

Manufacturer No:

MAX4090AAUT+

Description:

IC AMP BUFFER SOT23-6

Datasheet:

Datasheet

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MAX4090AAUT+ Specifications

  • Type
    Parameter
  • -3db Bandwidth
    55 MHz
  • Supplier Device Package
    SOT-6
  • Package / Case
    SOT-23-6
  • Mounting Type
    Surface Mount
  • Voltage - Supply, Single/Dual (±)
    2.7V ~ 5.5V
  • Current - Output / Channel
    85 mA
  • Current - Supply
    6.5 mA
  • Slew Rate
    275V/µs
  • Number of Circuits
    1
  • Output Type
    -
  • Applications
    Buffer
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The MB90F347ESPMC3-GS is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the requirements of a particular project, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High-performance: The MB90F347ESPMC3-GS is designed to deliver high-performance computing capabilities, making it suitable for applications that require fast and efficient processing. 2. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is crucial. 3. Integrated peripherals: The chip comes with various integrated peripherals such as UART, I2C, SPI, timers, and ADC, which can simplify the design and reduce the need for external components. 4. Robust communication capabilities: The chip supports various communication protocols like CAN, LIN, and UART, making it suitable for applications that require reliable and efficient data transfer. 5. Enhanced security features: The chip incorporates security features like memory protection units and encryption/decryption capabilities, making it suitable for applications that require secure data processing.Application scenarios: 1. Automotive systems: The MB90F347ESPMC3-GS is commonly used in automotive applications such as engine control units (ECUs), body control modules (BCMs), and instrument clusters. Its high-performance computing capabilities and support for communication protocols like CAN make it suitable for these applications. 2. Industrial automation: The chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and data processing. Its integrated peripherals and low power consumption make it suitable for these applications. 3. Consumer electronics: The chip can be used in various consumer electronic devices like home appliances, gaming consoles, and audio/video equipment. Its high-performance computing capabilities and low power consumption make it suitable for these applications. 4. Internet of Things (IoT): The chip can be used in IoT devices that require low power consumption, efficient data processing, and reliable communication capabilities. Its integrated peripherals and security features make it suitable for these applications. 5. Medical devices: The chip can be used in medical devices like patient monitoring systems, diagnostic equipment, and medical imaging devices. Its high-performance computing capabilities, integrated peripherals, and security features make it suitable for these applications.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of a particular project.