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LA8160V-TLM-E Specifications
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TypeParameter
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Supplier Device Package16-SSOP
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Package / Case16-LSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Applications-
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TypePreamplifier
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PackagingBulk
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Product StatusActive
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Series-
The LA8160V-TLM-E is an integrated circuit chip designed for use in audio applications. Some of its advantages and application scenarios include:1. High-quality audio processing: The LA8160V-TLM-E chip offers high-quality audio processing capabilities, making it suitable for applications that require clear and accurate sound reproduction.2. Low power consumption: This chip is designed to operate with low power consumption, making it ideal for battery-powered devices or applications where energy efficiency is crucial.3. Compact size: The LA8160V-TLM-E chip is compact in size, allowing for easy integration into various audio devices and systems.4. Wide range of applications: This chip can be used in a wide range of audio applications, including portable audio players, smartphones, tablets, gaming consoles, and other consumer electronics devices.5. Noise reduction and audio enhancement: The LA8160V-TLM-E chip incorporates features like noise reduction and audio enhancement algorithms, which can improve the overall audio experience in various scenarios.6. Compatibility with different audio formats: This chip supports various audio formats, including MP3, AAC, FLAC, and WAV, making it versatile and compatible with different audio sources.7. Customizable settings: The LA8160V-TLM-E chip allows for customizable settings, enabling manufacturers to fine-tune the audio processing parameters according to their specific requirements.Overall, the LA8160V-TLM-E integrated circuit chip offers high-quality audio processing, low power consumption, and compatibility with various audio formats, making it suitable for a wide range of audio applications.
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