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LA8123TT-TLM-E Specifications
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TypeParameter
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Supplier Device Package8-MSOP
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Package / Case8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
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Mounting TypeSurface Mount
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ApplicationsCATV
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TypeAmplifier
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PackagingBulk
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Product StatusActive
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Series-
The LA8123TT-TLM-E is an integrated circuit chip designed for audio processing applications. Some of its advantages and application scenarios include:1. High-quality audio processing: The LA8123TT-TLM-E chip is designed to provide high-quality audio processing capabilities, ensuring clear and crisp sound output.2. Noise reduction: It incorporates advanced noise reduction algorithms, which help in reducing background noise and improving the overall audio quality.3. Echo cancellation: The chip is equipped with echo cancellation features, which are useful in applications like hands-free calling or voice recognition systems, where echo can be a problem.4. Low power consumption: The LA8123TT-TLM-E chip is designed to operate efficiently with low power consumption, making it suitable for battery-powered devices or energy-efficient applications.5. Compact size: The chip comes in a compact form factor, making it suitable for integration into small-sized devices or applications where space is limited.6. Wide range of applications: The LA8123TT-TLM-E chip can be used in various audio processing applications, including smartphones, tablets, portable speakers, automotive audio systems, gaming consoles, and more.7. Easy integration: It offers easy integration with other components or systems, thanks to its standardized interfaces and compatibility with common audio processing protocols.Overall, the LA8123TT-TLM-E integrated circuit chip provides high-quality audio processing capabilities with low power consumption, making it suitable for a wide range of applications where audio enhancement and noise reduction are required.
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