LTC6430AIUF-20#TRPBF
Manufacturer No:
LTC6430AIUF-20#TRPBF
Manufacturer:
Description:
IC AMPLIFIER 24QFN
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LTC6430AIUF-20#TRPBF Specifications
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TypeParameter
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Supplier Device Package24-QFN (4x4)
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Package / Case24-WFQFN Exposed Pad
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Mounting TypeSurface Mount
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ApplicationsDriver
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TypeAmplifier
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The LTC6430AIUF-20#TRPBF is a high-performance integrated circuit chip designed for use in various applications. Some of its advantages and application scenarios include:1. Wideband RF Amplification: The LTC6430AIUF-20#TRPBF offers a wideband frequency range of 10MHz to 6GHz, making it suitable for amplifying signals across a broad spectrum. This makes it ideal for applications such as wireless communication systems, radar systems, and test and measurement equipment.2. Low Noise Figure: The chip has a low noise figure of 2.3dB, which helps in maintaining signal integrity and improving overall system performance. This makes it suitable for applications that require high sensitivity and low noise, such as radio receivers and sensitive measurement systems.3. High Linearity: The LTC6430AIUF-20#TRPBF provides high linearity with an input third-order intercept point (IIP3) of 30dBm. This makes it suitable for applications that require linear amplification, such as wireless infrastructure equipment and high-performance transceivers.4. Small Package Size: The chip is available in a small 16-lead 3mm x 3mm QFN package, which allows for compact and space-constrained designs. This makes it suitable for applications where size and weight are critical, such as portable devices and small form-factor systems.5. Ease of Integration: The LTC6430AIUF-20#TRPBF is a fully integrated chip that requires minimal external components, simplifying the design and reducing the bill of materials. This makes it suitable for applications where simplicity and ease of integration are important, such as consumer electronics and IoT devices.Overall, the LTC6430AIUF-20#TRPBF integrated circuit chip offers wideband amplification, low noise, high linearity, small package size, and ease of integration, making it suitable for a wide range of applications in the RF and wireless communication domains.
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