TSV912AIST

TSV912AIST

Manufacturer No:

TSV912AIST

Manufacturer:

STMicroelectronics

Description:

IC OPAMP GP 2 CIRCUIT 8MINISO

Datasheet:

Datasheet

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TSV912AIST Specifications

  • Type
    Parameter
  • -3db Bandwidth
    -
  • Gain Bandwidth Product
    8 MHz
  • Supplier Device Package
    8-MiniSO
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply Span (Max)
    5.5 V
  • Voltage - Supply Span (Min)
    2.5 V
  • Current - Output / Channel
    35 mA
  • Current - Supply
    780µA (x2 Channels)
  • Voltage - Input Offset
    1.5 mV
  • Current - Input Bias
    1 pA
  • Slew Rate
    4.5V/µs
  • Output Type
    Rail-to-Rail
  • Number of Circuits
    2
  • Amplifier Type
    General Purpose
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The TSV912AIST is a specific integrated circuit (IC) chip manufactured by STMicroelectronics. It is a dual operational amplifier designed for low-power and low-voltage applications. Some of the advantages and application scenarios of the TSV912AIST IC chip are:1. Low Power Consumption: The TSV912AIST is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.2. Low Voltage Operation: This IC chip can operate at low supply voltages, typically ranging from 1.8V to 5.5V. It is ideal for applications where low voltage operation is required, such as portable devices or low-power sensor circuits.3. Rail-to-Rail Inputs and Outputs: The TSV912AIST offers rail-to-rail input and output capabilities, allowing it to handle signals that span the entire supply voltage range. This feature is beneficial in applications where the input or output signals need to be accurately processed near the supply voltage rails.4. Wide Bandwidth and Fast Response: With a wide bandwidth and fast response time, the TSV912AIST is suitable for applications that require high-speed signal amplification or processing. It can be used in audio amplifiers, data acquisition systems, or other applications where fast response is essential.5. Small Package Size: The TSV912AIST is available in small package options, such as the SOT23-5 package, which makes it suitable for space-constrained applications or designs where miniaturization is a requirement.Application scenarios for the TSV912AIST IC chip include:1. Portable Devices: The low power consumption and low voltage operation of the TSV912AIST make it suitable for various portable devices like smartphones, tablets, wearable devices, or portable medical equipment.2. Sensor Interfaces: The rail-to-rail inputs and outputs, along with the small package size, make the TSV912AIST suitable for sensor interface applications. It can be used to amplify and process signals from various sensors like temperature sensors, pressure sensors, or light sensors.3. Audio Amplification: The wide bandwidth and fast response time of the TSV912AIST make it suitable for audio amplification applications. It can be used in audio systems, headphones, or portable speakers.4. Industrial and Automotive Electronics: The TSV912AIST can find applications in industrial or automotive electronics where low power consumption, low voltage operation, and small package size are desired. It can be used in control systems, motor drives, or sensor interfaces in these domains.It is important to note that the specific advantages and application scenarios may vary depending on the overall system requirements and design considerations.